AD5542A Analog Devices, AD5542A Datasheet - Page 20

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AD5542A

Manufacturer Part Number
AD5542A
Description
Manufacturer
Analog Devices
Datasheet

Specifications of AD5542A

Resolution (bits)
16bit
Dac Update Rate
n/a
Dac Settling Time
1µs
Max Pos Supply (v)
+5.5V
Single-supply
Yes
Dac Type
Unbuffered Vout
Dac Input Format
Ser,SPI

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AD5512A/AD5542A
OUTLINE DIMENSIONS
INDICATOR
SEATING
PLANE
0.80
0.75
0.70
PIN 1
0.15
0.05
4.50
4.40
4.30
PIN 1
Figure 40. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Figure 41. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
TOP VIEW
16
3.10
3.00 SQ
2.90
1
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
COMPLIANT TO JEDEC STANDARDS MO-153-AB
3 mm × 3 mm Body, Very Very Thin Quad
5.10
5.00
4.90
0.10
Dimensions shown in millimeters
Dimensions shown in millimeters
0.30
0.19
9
8
Rev. A | Page 20 of 24
1.20
MAX
SEATING
PLANE
0.20 REF
BSC
6.40
(CP-16-22)
0.50
0.40
0.30
BSC
(RU-16)
0.50
0.05 MAX
0.02 NOM
COPLANARITY
0.20
0.09
0.08
12
9
0.30
0.23
0.18
13
8
BOTTOM VIEW
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
16
5
1
4
0.25 MIN
1.75
1.60 SQ
1.45
0.75
0.60
0.45

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