AD7862 Analog Devices, AD7862 Datasheet - Page 3

• Manufacturer Part Number: AD7862
• Description: Simultaneous Sampling Dual 250 kSPS 12-Bit ADC
• Manufacturer: Analog Devices

Specifications of AD7862

• Resolution (bits): 12bit
• # Chan: 4
• Sample Rate: 250kSPS
• Interface: Par
• Analog Input Type: SE-Bip,SE-Uni
• Ain Range: Bip 10V,Bip 2.5V,Uni 2.5V
• Adc Architecture: SAR
• Pkg Type: DIP,SOIC,SOP

Model
AD7862AR-10
AD7862BR-10
AD7862ARS-10
AD7862AN-10
AD7862SQ-10
AD7862AR-3
AD7862BR-3
AD7862ARS-3
AD7862AN-3
AD7862AR-2
AD7862ARS-2
REV. 0
Parameter
LOGIC OUTPUTS
CONVERSION RATE
POWER REQUIREMENTS
NOTES
1
2
3
ABSOLUTE MAXIMUM RATINGS*
(T
V
V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog Input Voltage to AGND
Reference Input Voltage to AGND . . . –0.3 V to V
Digital Input Voltage to DGND . . . . . –0.3 V to V
Digital Output Voltage to DGND . . . . –0.3 V to V
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150 C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 670 mW
Temperature ranges are as follows: A, B Versions: –40 C to +85 C;
S Version: –55 C to +125 C.
See Terminology.
Performance measured through full channel (multiplexer, SHA and ADC).
DD
DD
Output High Voltage, V
Output Low Voltage, V
DB11–DB0
Output Coding
Conversion Time
Track/Hold Acquisition Time
V
I
Power Dissipation
A
AD7862-10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AD7862-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AD7862-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
Commercial (A, B Version) . . . . . . . . . . . –40 C to +85 C
Extended (S Version) . . . . . . . . . . . . . . . . –55 C to +125 C
DD
DD
= +25 C unless otherwise noted)
JA
Floating-State Leakage Current
Floating-State Capacitance
AD7862-10, AD7862-3
AD7863-2
Normal Mode
Standby Mode
Normal Mode
Standby Mode
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116 C/W
Input
0 V to 2.5 V
0 V to 2.5 V
Input
10 V
10 V
10 V
10 V
10 V
2.5 V
2.5 V
2.5 V
2.5 V
OL
OH
4
2, 3
Relative
Accuracy
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
1 LSB
A
Version
4.0
0.4
10
3.6
0.3
+5
15
25
75
125
10
1
DD
DD
DD
B
Version
4.0
0.4
10
3.6
0.3
+5
15
25
75
125
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
+ 0.3 V
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–55 C to +125 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
10
0.3 V
17 V
7 V
4
Specifications subject to change without notice.
Sample tested @ +25 C to ensure compliance.
–3–
Ceramic DIP Package, Power Dissipation . . . . . . . . . 670 mW
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
*Stresses above those listed under “Absolute Maximum Ratings” may cause
S
Version
4.0
0.4
10
3.6
0.3
+5
15
25
75
125
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
10
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260 C
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260 C
Lead Temperature, Soldering
Lead Temperature, Soldering
JA
JA
JA
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110 C/W
Package
Description
28-Bit Small Outline Package
28-Bit Small Outline Package
28-Bit Shrink Small Outline Package
28-Bit Plastic DIP
28-Bit Cerdip
28-Bit Small Outline Package
28-Bit Small Outline Package
28-Bit Shrink Small Outline Package
28-Plastic DIP
28-Bit Small Outline Package
28-Bit Shrink Small Outline Package
Units
V min
V max
pF max
V nom
mA max
mW max
A max
s max
s max
A max
W max
Test Conditions/Comments
I
I
Twos Complement
Straight (Natural) Binary
For Both Channels
Logic Inputs = 0 V or V
Typically 60 mW
Typically 75 W
SOURCE
SINK
5% for Specified Performance
= 1.6 mA
= 200 A
AD7862
Package
Option
R-28
R-28
RS-28
N-28
Q-28
R-28
R-28
RS-28
N-28
R-28
RS-28
DD