EL5623IRZ-T7 Intersil, EL5623IRZ-T7 Datasheet - Page 6

• Manufacturer Part Number: EL5623IRZ-T7
• Description: IC BUFFER 6XGAMMA 16-TSSOP
• Manufacturer: Intersil

Specifications of EL5623IRZ-T7

• Applications: TFT-LCD Panels: Gamma Buffer
• Number Of Circuits: 6
• -3db Bandwidth: 10MHz
• Slew Rate: 9 V/µs
• Current - Supply: 3.5mA
• Current - Output / Channel: 120mA
• Voltage - Supply, Single/dual (±): 4.5 V ~ 16.5 V, ±2.25 V ~ 8.25 V
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP Exposed Pad, 16-eTSSOP, 16-HTSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Description of Operation and Application
Information
Product Description
The EL5623 is fabricated using a high voltage CMOS
process. It exhibits rail to rail input and output capability and
has very low power consumption. When driving a load of
10K and 12pF, the buffers have a -3dB bandwidth of 10MHz
and exhibit 9V/µs slew rate.
Input, Output, and Supply Voltage Range
The EL5623 is specified with a single nominal supply voltage
from 5V to 15V or a split supply with its total range from 5V
to 15V. Correct operation is guaranteed for a supply range
from 4.5V to 16.5V.
The input common-mode voltage range of the EL5623 is
within 500mV beyond the supply rails. The output swings of
the buffers typically extend to within 100mV of the positive
and negative supply rails with load currents of 5mA.
Decreasing load currents will extend the output voltage even
closer to each supply rails.
Output Phase Reversal
The EL5623 is immune to phase reversal as long as the
input voltage is limited from V
Although the device's output will not change phase, the
input's over-voltage should be avoided. If an input voltage
exceeds supply voltage by more than 0.6V, electrostatic
protection diode placed in the input stage of the device begin
to conduct and over-voltage damage could occur.
Output Drive Capability
The EL5623 does not have internal short-circuit protection
circuitry. The buffers will limit the short circuit current to
±120mA if the outputs are directly shorted to the positive or
the negative supply. If the output is shorted indefinitely, the
power dissipation could easily increase such that the part will
be destroyed. Maximum reliability is maintained if the output
continuous current never exceeds ±30mA, a limit is set by
the design of the internal metal interconnections.
The Unused Buffers
It is recommended that any unused buffers should have their
inputs tied to ground plane.
Power Dissipation
With the high-output drive capability of the EL5623, it is
possible to exceed the 125°C “absolute-maximum junction
temperature” under certain load current conditions.
Therefore, it is important to calculate the maximum junction
temperature for the application to determine if load
conditions need to be modified for the buffer to remain in the
safe operating area.
S
6
- -0.5V to V
S
+ +0.5V.
EL5623
The maximum power dissipation allowed in a package is
determined according to:
where:
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the loads, or:
P
when sourcing, and:
P
when sinking.
where:
If we set the two P
can solve for the R
package power dissipation curves provide a convenient way
to see if the device will overheat. The maximum safe power
dissipation can be found graphically, based on the package
type and the ambient temperature. By using the previous
equation, it is a simple matter to see if P
device's power derating curves.
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended, lead lengths
should be as short as possible, and the power supply pins
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the V
connected to ground, one 0.1µF ceramic capacitor should be
placed from the V
capacitor should then be connected from the V
ground. One 4.7µF capacitor may be used for multiple
devices. This same capacitor combination should be placed
at each supply pin to ground if split supplies are to be used.
P
DMAX
DMAX
DMAX
T
T
θ
P
i = 1 to total number of buffers
V
I
V
I
SMAX
LOAD
JA
AMAX
JMAX
DMAX
S
OUT
= Total supply voltage of buffer and V
= Thermal resistance of the package
=
=
=
i = Maximum output voltage of the application
i = Load current of buffer
= Total quiescent current
= Maximum junction temperature
= Maximum ambient temperature
V
V
T
-------------------------------------------- -
= Maximum power dissipation in the package
JMAX
S
S
×
×
I
I
S
S
Θ
+
+
- T
JA
S
DMAX
Σi
Σi
LOAD
+ pin to ground. A 4.7µF tantalum
AMAX
×
×
( [
[
(
V
V
's to avoid device overheat. The
equations equal to each other, we
S
OUT
+
–
i
V
–
OUT
V
S
- )
i )
×
×
I
I
LOAD
DMAX
LOAD
COM
S
i ]
- pin is
i ]
exceeds the
S
+ pin to
May 6, 2005
FN7507.1