EL5329IREZ-T13 Intersil, EL5329IREZ-T13 Datasheet - Page 9

• Manufacturer Part Number: EL5329IREZ-T13
• Description: IC BUFFER MULTI-CHANNEL 28HTSSOP
• Manufacturer: Intersil

Specifications of EL5329IREZ-T13

• Applications: TFT-LCD Panels: Gamma Buffer, VCOM Driver
• Output Type: Rail-to-Rail
• Number Of Circuits: 11
• -3db Bandwidth: 10MHz
• Slew Rate: 9 V/µs
• Current - Supply: 5.5mA
• Current - Output / Channel: 120mA
• Voltage - Supply, Single/dual (±): 4.5 V ~ 16.5 V, ±2.25 V ~ 8.25 V
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP Exposed Pad, 28-eTSSOP, 28-HTSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Typical Performance Curves
FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 15. OVERSHOOT vs CAPACITANCE LOAD (V
800
700
600
500
400
300
200
50
40
30
20
10
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
FIGURE 17. SETTLING TIME vs STEP SIZE
0
1
0
0
2
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
714mW
V
R
V
V
R
C
800mW
909mW
TEMPERATURE
S
OPP
S
L
L
L
=±7.5V
=10kΩ
=±7.5V
=10kΩ
=8pF
θ
=1V
JA
TSSOP20
25
=140°C/W
AMBIENT TEMPERATURE (°C)
200
3
833mW
50
STEP SIZE (+V)
BUFFER
C
LOAD
9
400
75
4
(pF)
θ
85
θ
JA
HTSSOP28
JA
TSSOP28
=120°C/W
=110°C/W
100
V
θ
COM
HTSSOP20
JA
600
=125°C/W
(Continued)
5
125
150
800
6
EL5129, EL5329
COM
)
FIGURE 18. TOTAL HARMONIC DISTORTION vs OUTPUT
FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 16. OUTPUT IMPEDANCE vs FREQUENCY
100
1K
10
-10
-20
-30
-40
-50
-60
-70
-80
3.5
2.5
1.5
0.5
1
0
1K
3
2
1
0
0
0
1
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - HTSSOP
EXPOSED DIEPAD SOLDERED TO PCB PER
JESD51-5
V
VOLTAGE
TEMPERATURE
1.333W
1.111W
3.333W
2.857W
V
A
R
FREQ=200kHz
S
=±5V
S
V
L
=±5V
=+1
=1kΩ
2
25
AMBIENT TEMPERATURE (°C)
10K
3
FREQUENCY (Hz)
50
4
BUFFER
5
V
100K
OPP
75
θ
6
HTSSOP28
85
(V)
JA
=30°C/W
V
100
7
COM
BUFFER
θ
HTSSOP20
JA
θ
θ
1M
JA
JA
TSSOP28
TSSOP20
=35°C/W
8
=75°C/W
=90°C/W
125
V
COM
9
May 13, 2005
10
10M
150
FN7430.1