CLC5622IN National Semiconductor, CLC5622IN Datasheet - Page 15

• Manufacturer Part Number: CLC5622IN
• Description: IC AMP VIDEO DUAL 8-DIP
• Manufacturer: National Semiconductor

Specifications of CLC5622IN

• Applications: Current Feedback
• Number Of Circuits: 2
• -3db Bandwidth: 160MHz
• Slew Rate: 370 V/µs
• Current - Supply: 3.2mA
• Current - Output / Channel: 130mA
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: *CLC5622IN

The maximum power that the DIP and SOIC packages can
dissipate at a given temperature is illustrated in Figure 9.
The power derating curve for any CLC5622 package can be
derived by utilizing the following equation:
where
T
θ
given package (˚C/W)
Layout Considerations
A proper printed circuit layout is essential for achieving high
frequency performance. National provides evaluation boards
for the CLC5622 (CLC730038-DIP, CLC730036-SOIC) and
suggests their use as a guide for high frequency layout and
as an aid for device testing and characterization.
General layout and supply bypassing play major roles in high
frequency performance. Follow these steps below as a basis
for high frequency layout:
Evaluation Board Information
A data sheet is available for the CLC730038/CLC730036
evaluation boards. The evaluation board data sheet pro-
vides:
• Include 6.8µF tantalum and 0.1µF ceramic capacitors on
• Place the 6.8µF capacitors within 0.75 inches of the
• Place the 0.1µF capacitors less than 0.1 inches from the
• Remove the ground plane under and around the part,
• Minimize all trace lengths to reduce series inductances.
• Use flush-mount printed circuit board pins for prototyping,
• Evaluation board schematics
• Evaluation board layouts
•
JA
amb
=Thermal resistance, from junction to ambient, for a
both supplies.
power pins.
power pins.
especially near the input and output pins to reduce para-
sitic capacitance.
never use high profile DIP sockets.
General information about the boards
=Ambient temperature (˚C)
FIGURE 9. Power Derating Curves
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The evaluation boards are designed to accommodate dual
supplies. The boards can be modified to provide single
supply operation. For best performance; 1) do not connect
the unused supply, 2) ground the unused supply pin.
SPICE Models
SPICE models provide a means to evaluate amplifier de-
signs. Free SPICE models are available for National’s mono-
lithic amplifiers that:
The readme file that accompanies the diskette lists released
models, and provides a list of modeled parameters. The
application note OA-18, Simulation SPICE Models for Na-
tional’s Op Amps, contains schematics and a reproduction of
the readme file.
Application Circuits
Single Supply Cable Driver
The typical application shown below shows one of the
CLC5622 amplifiers driving 10m of 75Ω coaxial cable. The
CLC5622 is set for a gain of +2V/V to compensate for the
divide-by-two voltage drop at V
Single Supply Lowpass Filter
Figure 12 and Figure 13 illustrate a lowpass filter and design
equations. The circuit operates from a single supply of +5V.
The voltage divider biases the non-inverting input to 2.5V.
And the input is AC coupled to prevent the need for level
• Support Berkeley SPICE 2G and its many derivatives
• Reproduces typical DC, AC, Transient, and Noise perfor-
• Support room temperature simulations
mance
FIGURE 11. Response After 10m of Cable
FIGURE 10. Single Supply Cable Driver
O
.
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