CLC5602IM National Semiconductor, CLC5602IM Datasheet - Page 14

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CLC5602IM

Manufacturer Part Number
CLC5602IM
Description
IC AMP VIDEO DUAL HI OUT 8-SOIC
Manufacturer
National Semiconductor
Datasheet

Specifications of CLC5602IM

Applications
Current Feedback
Number Of Circuits
2
-3db Bandwidth
135MHz
Slew Rate
300 V/µs
Current - Supply
1.6mA
Current - Output / Channel
130mA
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*CLC5602IM

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Application Division
The maximum power that the DIP and SOIC packages can
dissipate at a given temperature is illustrated in Figure 9 .
The power derating curve for any CLC5602 package can be
derived by utilizing the following equation:
where T
given package (˚C/W)
Layout Considerations
A proper printed circuit layout is essential for achieving high
frequency performance. National provides evaluation boards
for the CLC5602 (CLC730038-DIP, CLC730036-SOIC) and
suggests their use as a guide for high frequency layout and
as an aid for device testing and characterization.
General layout and supply bypassing play major roles in high
frequency performance. Follow the steps below as a basis
for high frequency layout:
Evaluation Board Information
A data sheet is available for the CLC730038/CLC730036
evaluation boards. The evaluation board data sheet
provides:
The evaluation boards are designed to accommodate dual
supplies. The boards can be modified to provide single
supply operation. For best performance; 1) do not connect
the unused supply, 2) ground the unused supply pin.
• Place the 6.8µF capacitors within 0.75 inches of the
• Place the 0.1µF capacitors less than 0.1 inches from the
• Remove the ground plane under and around the part,
• Minimize all trace lengths to reduce series inductances.
• Use flush-mount printed circuit board pins for prototyping,
• Evaluation board schematics
• Evaluation board layouts
• General information about the boards
JA
= Thermal resistance, from junction to ambient, for a
both supplies.
power pins.
power pins.
especially near the input and output pins to reduce
parasitic capacitance.
never use high profile DIP sockets.
Include 6.8µF tantalum and 0.1µF ceramic capacitors on
amb
FIGURE 9. Power Derating Curves
= Ambient temperature (˚C)
(Continued)
DS015000-48
14
SPICE Models
SPICE models provide a means to evaluate amplifier
designs. Free SPICE models are available for National’s
monolithic amplifiers that:
• Support Berkeley SPICE 2G and its many derivatives
• Reproduce typical DC, AC, Transient, and Noise
• Support room temperature simulations
The readme file that accompanies the diskette lists released
models, and provides a list of modeled parameters. The
application note OA-18, Simulation SPICE Models for
National’s
reproduction of the readme file.
Application Circuits
Single Supply Cable Driver
The typical application shown below shows one of the
CLC5602 amplifiers driving 10m of 75
CLC5602 is set for a gain of +2V/V to compensate for the
divide-by-two voltage drop at V
Single Supply Lowpass Filter
Figure 12 and Figure 13 illustrate a lowpass filter and design
equations. The circuit operates from a single supply of +5V.
The voltage divider biases the non-inverting input to 2.5V.
And the input is AC coupled to prevent the need for level
shifting the input signal at the source. Use the design
equations to determine R
desired Q and corner frequency.
V
in
performance
0.1 F
FIGURE 11. Response After 10m of Cable
5k
FIGURE 10. Single Supply Cable Driver
0.1 F
V
in
Op
= 10MHz, 0.5V
5k
1k
3
2
Amps,
CLC5602
+
-
+5V
1/2
8
4
1k
6.8 F
0.1 F
+
pp
1
1
contains
20ns/div
, R
2
0.1 F
o
, C
.
1
, and C
75
schematics
coaxial cable. The
Coaxial Cable
10m of 75
2
based on the
DS015000-50
DS015000-49
and
75
V
o
a

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