ADD8707WCPZ-REEL7 Analog Devices Inc, ADD8707WCPZ-REEL7 Datasheet - Page 14

• Manufacturer Part Number: ADD8707WCPZ-REEL7
• Description: IC GAMMA BUFFER 12CHAN 48LFCSP
• Manufacturer: Analog Devices Inc

Specifications of ADD8707WCPZ-REEL7

• Applications: TFT-LCD Panels: Gamma Buffer, VCOM Driver
• Number Of Circuits: 12
• -3db Bandwidth: 4.5MHz
• Slew Rate: 6 V/µs
• Current - Supply: 8.3mA
• Current - Output / Channel: 15mA
• Voltage - Supply, Single/dual (±): 7.5 V ~ 16 V
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN, CSP Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADD8707
OPERATING TEMPERATURE RANGE
The junction temperature is as follows:
where:
T
θ
P
For the ADD8707, P
where:
V
I
dissipation (current comes from V
−I
dissipation (current goes to GND).
(V
In this example, T
values in Table 6.
Table 6.
V
V
V
V
V
V
V
V
V
V
V
V
Σ(I
OUT X(+)
JA
DIS
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
AMB
DD
T
OU XT(-)
OUT X(+)
DD
= junction-to-ambient thermal resistance, in °C/watt.
J
12
11
10
9
8
7
6
5
4
3
2
1
= power dissipated in the device, in watts.
× I
P
= T
= ambient temperature specified on the data sheet.
– V
DIS
DQ
× (V
× (V
AMB
× V
= V
REG OUT
= nominal system power requirements.
Σ(−I
+ θ
DD
OUT X
DD
DD
V
14.400
12.067
10.512
10.051
9.878
8.554
6.134
4.982
4.694
4.205
2.736
0.202
− V
− V
) × I
OUT X
JA
× I
OUT X(-)
× P
= negative-current amplifier load power
OUT X
AMB
DQ
OUT X
LOAD
(V)
DIS
DIS
+ Σ(I
)) + Σ(−I
= 95°C. To calculate P
× V
) = positive-current amplifier load power
can be calculated by
= regulator load power dissipation.
OUT X(+)
OUTX
OUT X(-)
) + (V
I
8.3
7.9
−4.5
−4.2
5.6
−3.3
−6.9
5.7
3.5
9.6
9.5
−7.2
× (V
OUT X
× V
DD
DD
).
DD
(mA)
OUT X
– V
− V
)
REG OUT
OUT X
DIS
, assume the
)) +
) × I
P (W)
0.0133
0.0311
0.0473
0.0422
0.0343
0.0282
0.0423
0.0628
0.0396
0.113
0.126
0.00145
0.582
LOAD
Rev. A | Page 14 of 20
Example 1
Exposed pad soldered down with via θ
The maximum junction temperature that is guaranteed before
the part breaks down is 150°C. is The maximum process limit
is 125°C. Because T
demonstrates a condition where the part should perform within
process limits.
Example 2
Exposed pad not soldered down θ
In this example, T
should not exhibit any damage here, the process limits have
been exceeded. The part may no longer operate as intended.
These examples show that soldering down the exposed pad is
important for proper heat dissipation. Under the same power-
up and loading conditions, the unsoldered part has a higher
temperature than the soldered part. Therefore, it is strongly
advised that the exposed pad be soldered down.
V
(V
P
T
T
DIS
J
J
DD
DD
= 95°C + (28.3°C/W) × (0.830 W) = 118.5°C
= 95°C + (47.7°C/W) × (0.830 W) = 134.6°C
= 0.240W + 0.582W + 0.008W = 0.830W.
× I
– V
DQ
REG OUT
= 16 V × 15 mA = 0.240 W.
) × I
J
is < 150°C but > 125°C. Although the part
J
is < 150°C and < 125°C, this example
LOAD
= (16 V – 14.4 V) × 5 mA = 0.008 W.
JA
= 47.7°C/W:
JA
= 28.3°C/W: