ADD8701ACP-R2 Analog Devices Inc, ADD8701ACP-R2 Datasheet - Page 3

• Manufacturer Part Number: ADD8701ACP-R2
• Description: IC 12-CH GAMMA BUFFERS 32-LFCSP
• Manufacturer: Analog Devices Inc

Specifications of ADD8701ACP-R2

• Rohs Status: RoHS non-compliant
• Applications: TFT-LCD Panels: Gamma Buffer, VCOM Driver
• Number Of Circuits: 12
• -3db Bandwidth: 4.5MHz
• Slew Rate: 6 V/µs
• Current - Supply: 10mA
• Current - Output / Channel: 10mA
• Voltage - Supply, Single/dual (±): 7 V ~ 16 V, ±3.5 V ~ 8 V
• Mounting Type: Surface Mount
• Package / Case: 32-LFCSP

ABSOLUTE MAXIMUM RATINGS*
Supply Voltage (V
Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range . . . . . . . . . . . . –40°C to +85°C
Junction Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300°C
ESD Tolerance (HBM) . . . . . . . . . . . . . . . . . . . . . . . ±1,000 V
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
Package Type
32-Lead LFCSP (CP)
NOTES
1
2
Model
ADD8701ACP –40°C to +85°C 32-Lead LFCSP CP-32
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADD8701 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. 0
θ
in circuit board for surface-mount packages.
ψ
temperature.
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
JA
JB
is specified for worst-case conditions, i.e., θ
is applied for calculating the junction temperature by reference to the board
Temperature
Range
DD
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
ORDERING GUIDE
35
JA
1
Package
Description
JA
is specified for device soldered
13
JB
2
Unit
°C/W
DD
Package
Option
+ 0.5 V
–3–
Pin No.
1, 15, 23
2
3–14
16, 24, 31
17–22, 25–30
32
VCOM IN 2
PIN FUNCTION DESCRIPTION
IN12 3
IN11 4
IN10 5
Mnemonic
V
VCOM IN
IN12–IN1
GND
V1–V12
VCOM OUT
V
IN9 6
IN8 7
IN7 8
PIN CONFIGURATION
DD
DD
1
PIN 1
INDICATOR
ADD8701
TOP VIEW
Description
Power (+)
VCOM Buffer Input
Gamma Buffer Inputs
Power (–)
Gamma Buffer Outputs
VCOM Buffer Output
24 GND
23 V
22 V6
21 V5
20 V4
19 V3
18 V2
17 V1
ADD8701
DD