AT32UC3A0256 Atmel Corporation, AT32UC3A0256 Datasheet - Page 64
AT32UC3A0256
Manufacturer Part Number
AT32UC3A0256
Description
Manufacturer
Atmel Corporation
Datasheets
1.AT32UC3A0128.pdf
(98 pages)
2.AT32UC3A0128.pdf
(826 pages)
3.AT32UC3A0128.pdf
(377 pages)
4.AT32UC3A0128.pdf
(33 pages)
5.AT32UC3A0128.pdf
(159 pages)
Specifications of AT32UC3A0256
Flash (kbytes)
256 Kbytes
Pin Count
144
Max. Operating Frequency
66 MHz
Cpu
32-bit AVR
# Of Touch Channels
32
Hardware Qtouch Acquisition
No
Max I/o Pins
109
Ext Interrupts
109
Usb Transceiver
1
Usb Speed
Full Speed
Usb Interface
Device + OTG
Spi
6
Twi (i2c)
1
Uart
4
Ssc
1
Ethernet
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
384
Resistive Touch Screen
No
Dac Channels
2
Dac Resolution (bits)
16
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
64
Self Program Memory
YES
External Bus Interface
1
Dram Memory
sdram
Nand Interface
No
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
3.0-3.6 or (1.65-1.95+3.0-3.6)
Operating Voltage (vcc)
3.0-3.6 or (1.65-1.95+3.0-3.6)
Fpu
No
Mpu / Mmu
Yes / No
Timers
10
Output Compare Channels
16
Input Capture Channels
6
Pwm Channels
13
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT32UC3A0256-ALUT
Manufacturer:
ATMEL
Quantity:
167
32058KS–AVR32–01/12
13. Mechanical Characteristics
13.1
13.1.1
13.1.2
Thermal Considerations
Thermal Data
Junction Temperature
Table 13-1
Table 13-1.
The average chip-junction temperature, T
where:
• θ
• θ
• θ
• P
• T
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
1.
2.
64.
Table 13-1 on page
Consumption” on page
JA
JC
JA
JC
JA
JC
HEAT SINK
A
D
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
T
T
J
J
=
=
T
summarizes the thermal resistance data depending on the package.
= cooling device thermal resistance (°C/W), provided in the device datasheet.
T
A
A
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
64.
θ
HEATSINK
JA
44.
)
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
TQFP100
TQFP100
LQFP144
LQFP144
Package
AT32UC3A
Table 13-1 on page
43.4
39.8
Typ
5.5
8.9
”Power
J
⋅C/W
⋅C/W
in °C.
Unit
64