ISL59831IRTZ-T7 Intersil, ISL59831IRTZ-T7 Datasheet - Page 10

IC VIDEO DVR SGL 3.3V 12-TDFN

ISL59831IRTZ-T7

Manufacturer Part Number
ISL59831IRTZ-T7
Description
IC VIDEO DVR SGL 3.3V 12-TDFN
Manufacturer
Intersil
Datasheet

Specifications of ISL59831IRTZ-T7

Applications
Reconstruction Filter
Number Of Circuits
1
Current - Supply
6mA
Current - Output / Channel
50mA
Voltage - Supply, Single/dual (±)
3 V ~ 3.6 V
Mounting Type
Surface Mount
Package / Case
12-TDFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
GND will disable the amplifier. The amplifier will be enabled
when the signal at ENABLE pin is 2V above GND.
Output Drive Capability
The maximum output current for the ISL59831 is set at
±50mA. Maximum reliability is maintained if the output
current never exceeds ±50mA, after which the electro-
migration limit of the process will be exceeded and the part
will be damaged. This limit is set by the design of the internal
metal interconnections.
Power Dissipation
With the high output drive capability of the ISL59831, it is
possible to exceed the +150°C absolute maximum junction
temperature under certain load current conditions.
Therefore, it is important to calculate the maximum junction
temperature for an application to determine if load conditions
or package types need to be modified to assure operation of
the amplifier in a safe operating area.
The maximum power dissipation allowed in a package is
determined according to Equation 1:
PD
Where:
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the load, or:
for sourcing:
for sinking:
Where:
PD
PD
T
T
Θ
V
I
V
R
I
i = Number of output channels
SMAX
LOAD
MAX
AMAX
MAX
MAX
JMAX
S
OUT
JA
LOAD
= Supply voltage
= Thermal resistance of the package
=
=
=
= Maximum output voltage of the application
= Load current
= Maximum quiescent supply current
= Maximum junction temperature
= Maximum ambient temperature
= Load resistance tied to ground
T
-------------------------------------------- -
V
V
JMAX
S
S
×
×
I
I
Θ
SMAX
SMAX
JA
T
AMAX
+
+
(
(
V
V
S
OUT
10
V
i V
OUT
S
i
)
)
×
×
I
V
-----------------
LOAD
OUT
R
L
i
i
i
(EQ. 1)
(EQ. 2)
(EQ. 3)
ISL59831
By setting the two P
can solve the output current and R
overheat.
Power Supply Bypassing and Printed Circuit
Board Layout
Strip line design techniques are recommended for the input
and output signal traces. As with any high frequency device,
a good printed circuit board layout is necessary for optimum
performance. Lead lengths should be as short as possible.
The power supply pin must be well bypassed to reduce the
risk of oscillation. For normal single supply operation, a
single 4.7µF tantalum capacitor in parallel with a 0.1µF
ceramic capacitor from V
For good AC performance, parasitic capacitance should be
kept to a minimum. Use of wire-wound resistors should be
avoided because of their additional series inductance. Use
of sockets should also be avoided if possible. Sockets add
parasitic inductance and capacitance can result in
compromised performance. Minimizing parasitic capacitance
at the amplifier's inverting input pin is also very important.
DMAX
CC
equations equal to each other, we
and V
CP
LOAD
to GND will suffice.
to avoid the device
March 29, 2007
FN6266.0

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