EM636165TS-7G Etron Technology Inc., EM636165TS-7G Datasheet

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EM636165TS-7G

Manufacturer Part Number
EM636165TS-7G
Description
Manufacturer
Etron Technology Inc.
Datasheet

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Features
• Fast access time: 5/5/5.5/5.5 ns
• Fast clock rate: 183/166/143 MHz
• Self refresh mode: standard and low power
• Internal pipelined architecture
• 512K word x 16-bit x 2-bank
• Programmable Mode registers
• Individual byte controlled by LDQM and UDQM
• Auto Refresh and Self Refresh
• 4096 refresh cycles/64ms
• CKE power down mode
• JEDEC standard +3.3V ± 0.3V power supply
• Interface: LVTTL
• 50-pin 400 mil plastic TSOP II package
• 60-ball, 6.4x10.1mm VFBGA package
- CAS Latency: 2, or 3
- Burst Length: 1, 2, 4, 8, or full page
- Burst Type: interleaved or linear burst
- Burst stop function
- Pb free and Halogen free
- Pb free
Etron Confidential
Key Specifications
Ordering Information
TS : indicates TSOP II package
VE : indicates VFBGA package
L: indicates Low Power
G: indicates Pb and Halogen Free for TSOPII Package
Etron Technology, Inc.
No. 6, Technology Road V, Science-Based Industrial Park, Hsinchu, Taiwan 30077, R.O.C
TEL: (886)-3-5782345
Etron Technology, Inc., reserves the right to make changes to its products and specifications without notice.
t
t
t
EM636165TS/VE-55G
EM636165TS/VE-6G
EM636165TS/VE-7G
EM636165TS/VE-7LG
t
RAS Row Active time(max.)
CK3 Clock Cycle time(min.)
AC3 Access time from CLK(max.)
RC
i
ndicates Pb Free for VFBGA Package
Part Number
Row Cycle time(min.)
EM636165
FAX: (886)-3-5778671
Frequency
183MHz
166MHz
143MHz
143MHz
1M x 16 bit Synchronous DRAM (SDRAM)
Overview
synchronous DRAM containing 16 Mbits. It is internally
configured as a dual 512K word x 16 DRAM with a
synchronous interface (all signals are registered on the
positive edge of the clock signal, CLK). Each of the
512K x 16 bit banks is organized as 2048 rows by 256
columns by 16 bits. Read and write accesses to the
SDRAM are burst oriented; accesses start at a selected
location and continue for a programmed number of
locations in a programmed sequence. Accesses begin
with the registration of a BankActivate command which
is then followed by a Read or Write command.
Write burst lengths of 1, 2, 4, 8, or full page, with a burst
termination option. An auto precharge function may be
enabled to provide a self-timed row precharge that is
initiated at the end of the burst sequence. The refresh
functions, either Auto or Self Refresh are easy to use.
By having a programmable mode register, the system
can choose the most suitable modes to maximize its
performance. These devices are well suited for
applications requiring high memory bandwidth and
particularly well suited to high performance PC
applications
TSOP II, VFBGA
TSOP II, VFBGA
TSOP II, VFBGA
TSOP II, VFBGA
The EM636165 SDRAM is a high-speed CMOS
The EM636165 provides for programmable Read or
38.5/42/49/49 ns
56.5/60/70/70 ns
5/5/5.5/5.5
Package
-55/6/7/7L
5.5/6/7/7
ns
ns
(Rev.3.4, Apr./2008)
EM636165

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EM636165TS-7G Summary of contents

Page 1

... Row Cycle time(min.) RC Ordering Information Part Number EM636165TS/VE-55G EM636165TS/VE-6G EM636165TS/VE-7G EM636165TS/VE-7LG TS : indicates TSOP II package VE : indicates VFBGA package L: indicates Low Power G: indicates Pb and Halogen Free for TSOPII Package ndicates Pb Free for VFBGA Package i Etron Technology, Inc. No. 6, Technology Road V, Science-Based Industrial Park, Hsinchu, Taiwan 30077, R.O.C TEL: (886)-3-5782345 Etron Technology, Inc ...

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Pin Assignment (TSOP II Top View) 1 VDD DQ0 2 DQ1 3 VSSQ 4 5 DQ2 DQ3 6 VDDQ 7 DQ4 8 DQ5 9 10 VSSQ DQ6 11 DQ7 12 VDDQ 13 14 LDQM 15 WE# CAS# 16 RAS# 17 ...

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Block Diagram CLOCK CLK BUFFER CKE CS# RAS# COMMAND CAS# DECODER WE# COLUMN A10/AP COUNTER A0 ADDRESS BUFFER A9 A11 REFRESH COUNTER CONTROL SIGNAL GENERATOR MODE REGISTER 3 EM636165 2048x256 x 16 CELL ARRAY (BANK #0) Column Decoder DQ0 DQs ...

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Pin Descriptions Symbol Type CLK Input Clock: CLK is driven by the system clock. All SDRAM input signals are sampled on the positive edge of CLK. CLK also increments the internal burst counter and controls the output registers. CKE Input ...

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LDQM, Input Data Input/Output Mask: LDQM and UDQM are byte specific, nonpersistent I/O buffer controls. The I/O buffers are placed in a high-z state when UDQM LDQM/UDQM is sampled HIGH. Input data is masked when LDQM/UDQM is sampled HIGH during ...

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Operation Mode Fully synchronous operations are performed to latch the commands at the positive edges of CLK. Table 2 shows the truth table for the operation commands. Command BankActivate BankPrecharge PrechargeAll Write Write and AutoPrecharge Read Read and Autoprecharge Mode ...

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Commands 1 BankActivate (RAS# = "L", CAS# = "H", WE# = "H", A11 = Bank, A0-A10 = Row Address) The BankActivate command activates the idle bank designated by the BA signals. By latching the row address A10 ...

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CLK COMMAND CAS# latency=2 t DQ’s CK2, CAS# latency=3 t DQ’s CK3, Burst Read Operation The read data appears on the DQs subject to the values on the LDQM/UDQM inputs two clocks earlier (i.e. LDQM/UDQM latency is two clocks for ...

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T0 CLK DQM COMMAND NOP CAS# latency=2 ’ CK2, Read to Write Interval T0 T1 CLK DQM COMMAND NOP READ A ’ Read to Write Interval T0 CLK DQM COMMAND NOP CAS# latency=2 ’ t ...

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T0 CLK Bank, ADDRESS Col A READ A COMMAND CAS# latency=2 ’ CK2, CAS# latency=3 ’ CK3, 5 Read and AutoPrecharge command (RAS# = "H", CAS# = "L", WE# = "H", A11 = “V”, ...

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T0 CLK NOP COMMAND ’ Write Interrupted by a Write The Read command that interrupts a write burst without auto precharge function should be issued one cycle after the clock edge in which the last data-in element is ...

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CLK DQM WRITE COMMAND ADDRESS DQ Note: The LDQM/UDQM can remain low in this example if the length of the write burst Write and AutoPrecharge command (refer to the following figure) (RAS# = "H", CAS# ...

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T0 T1 CLK CKE CS# RAS# CAS# WE# A11 A10 A0-A9 DQM DQ Hi-Z Mode Register Set Cycle The mode register is divided into various fields depending on functionality. Address A11,10 Function RFU* *Note: RFU (Reserved for future use) should ...

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Addressing Mode Select Field (A3) The Addressing Mode can be one of two modes, Interleave Mode or Sequential Mode. Sequential Mode supports burst length full page, but Interleave Mode only supports burst length ...

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Test Mode field (A8~A7) These two bits are used to enter the test mode and must be programmed to "00" in normal operation • Write Burst Length (A9) This bit is ...

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T0 CLK NOP COMMAND CAS# latency=2,3 ’ CK1, Termination of a Burst Write Operation 11 Device Deselect command (CS# = "H") The Device Deselect command disables the command decoder so that the RAS#, CAS#, WE# and Address ...

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Clock Suspend Mode Entry / PowerDown Mode Entry command (refer to Figures 6, 7, and 8 in Timing Waveforms) (CKE = "L") When the SDRAM is operating the burst cycle, the internal CLK is suspended(masked) from the subsequent cycle ...

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Absolute Maximum Rating Symbol Item Input, Output Voltage IN OUT Power Supply Voltage DD DDQ T Operating Temperature A T Storage Temperature STG P Power Dissipation D I Short Circuit Output Current OUT Recommended ...

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Recommended D.C. Operating Conditions Description/Test condition Operating Current ≥ (min), Outputs Open RC RC One bank active Precharge Standby Current in non-power down mode = 15ns, CS# ≥ V (min), CKE ≥ Input signals ...

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Electrical Characteristics and Recommended A.C. Operating Conditions = 3.3V ± 0.3V 0~70 ° C) (Note Symbol A.C. Parameter t Row cycle time RC (same bank) t RAS# to CAS# delay RCD ...

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A.C. Test Conditions LVTTL Interface Reference Level of Output Signals Output Load Input Signal Levels Transition Time (Rise and Fall) of Input Signals Reference Level of Input Signals Output 30pF LVTTL D.C. Test Load (A) 7. Transition times are ...

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Timing Waveforms Figure 1. AC Parameters for Write Timing T10 CLK CKE CS# RAS# CAS# WE# A11 t ...

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Figure 2. AC Parameters for Read Timing CLK CKE t IS CS# RAS# CAS# WE# A11 A10 RAx t IS A0-A9 RAx DQM Hi-Z DQ Activate Command Bank A Etron Confidential (Burst ...

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Figure 3. Auto Refresh (CBR T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 A0- DQM DQ Precharge All Auto Refresh Command Command Etron Confidential (Burst ...

Page 25

Figure 4. Power on Sequene and Auto Refresh (CBR T10 CLK t CK CKE High Level is reauired CS# RAS# CAS# WE# A11 A10 Address Key A0-A9 DQM t RP ...

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Figure 5. Self Refresh Entry & Exit Cycle CLK *Note 2 *Note 1 CKE t IS CS# *Note 8 RAS# CAS# A11 A0-A9 WE# DQM Hi-Z DQ Self Refresh Enter Note: To Enter SelfRefresh Mode ...

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Figure 6.1. Clock Suspension During Burst Read (Using CKE) (Burst Length=4, CAS# Latency= T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAx A0-A9 RAx CAx DQM Hi-Z ...

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Figure 6.2. Clock Suspension During Burst Read (Using CKE) (Burst Length=4, CAS# Latency= T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAx A0-A9 RAx CAx DQM Hi-Z ...

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Figure 7.1. Clock Suspension During Burst Write (Using CKE) (Burst Length=4, CAS# Latency= T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAx A0-A9 RAx CAx DQM Hi-Z ...

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Figure 7.2. Clock Suspension During Burst Write (Using CKE) (Burst Length=4, CAS# Latency= T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAx A0-A9 RAx CAx DQM Hi-Z ...

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Figure 8. Power Down Mode and Clock Mask T10 CLK CKE CS# RAS# CAS# WE# A11 A10 RAx A0-A9 RAx DQM Hi-Z DQ ACTIVE ...

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Figure 9.1. Random Column Read (Page within same Bank) (Burst Length=4, CAS# Latency= T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAw RAx A0-A9 RAw CAw DQM ...

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Figure 9.2. Random Column Read (Page within same Bank) (Burst Length=4, CAS# Latency= T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAx RAw A0-A9 RAw CAw DQM ...

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Figure 10.1. Random Column Write (Page within same Bank) (Burst Length=4, CAS# Latency= T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAx RBw A0-A9 RBw CBw DQM ...

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Figure 10.2. Random Column Write (Page within same Bank) (Burst Length=4, CAS# Latency= T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAx RBw A0-A9 RBw CBw DQM ...

Page 36

Figure 11.1. Random Row Read (Interleaving Banks) (Burst Length=8, CAS# Latency= T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RBx A0-A9 RBx CBx ...

Page 37

Figure 11.2. Random Row Read (Interleaving Banks) (Burst Length=8, CAS# Latency= T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RBx A0-A9 RBx CBx t RCD DQM ...

Page 38

Figure 12.1. Random Row Write (Interleaving Banks) (Burst Length=8, CAS# Latency= T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RAx A0-A9 RAx CAx t RCD DQM ...

Page 39

Figure 12.2. Random Row Write (Interleaving Banks) (Burst Length=8, CAS# Latency= T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RAx A0-A9 RAx CAx t RCD DQM ...

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Figure 13.1. Read and Write Cycle T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAx RAx A0-A9 RAx CAx DQM Hi-Z DQ Ax0 Activate Read Cammand Command ...

Page 41

Figure 13.2. Read and Write Cycle T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAx RAx A0-A9 RAx CAx DQM Hi-Z DQ Activate Read Cammand Command Bank ...

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Figure 14.1. Interleaving Column Read Cycle T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAx RAx RAx A0-A9 RAx CAy RAx RCD DQM Hi-Z ...

Page 43

Figure 14.2. Interleaved Column Read Cycle T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RBx RAx RAx A0-A9 RAx CAx RBx t RCD DQM Hi-Z DQ Activate ...

Page 44

Figure 15.1. Interleaved Column Write Cycle T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAx RAx RBw A0-A9 RAx CAx RBw t RCD DQM t RRD Hi-Z ...

Page 45

Figure 15.2. Interleaved Column Write Cycle T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RBw RAx RAx A0-A9 RAx CAx RBw t RCD DQM t >t RCD ...

Page 46

Figure 16.1. Auto Precharge after Read Burst T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RAx RAx RBx A0-A9 RAx CAx RBx DQM Hi-Z DQ Ax0 ...

Page 47

Figure 16.2. Auto Precharge after Read Burst T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RAx RAx RBx A0-A9 RAx CAx RBx DQM Hi-Z DQ Activate ...

Page 48

Figure 17.1. Auto Precharge after Write Burst T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RAx RAx RBx A0-A9 RAx CAx RBx DQM Hi-Z DQ DAx0 ...

Page 49

Figure 17.2. Auto Precharge after Write Burst T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RAx RAx RBx A0-A9 RAx CAx RBx DQM Hi-Z DQ DAx0 ...

Page 50

Figure 18.1. Full Page Read Cycle T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RAx RBx A0-A9 RAx CAx RBx DQM Hi Activate Read ...

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Figure 18.2. Full Page Read Cycle T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RAx RBx A0-A9 RAx CAx RBx DQM Hi-Z DQ Activate Read Activate ...

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Figure 19.1. Full Page Write Cycle T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RAx RBx A0-A9 RAx CAx RBx DQM Hi-Z DQ DAx DAx+1 DAx+2 ...

Page 53

Figure 19.2. Full Page Write Cycle T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RAx RBx A0-A9 RAx CAx RBx DQM Hi-Z DQ DAx DAx+1 DAx+2 ...

Page 54

Figure 20. Byte Write Operation T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RAx A0-A9 RAx CAx LDQM UDQM DQ0-DQ7 Ax0 DQ8-DQ15 Activate Read Upper Bytes ...

Page 55

Figure 21. Random Row Read (Interleaving Banks) (Burst Length=2, CAS# Latency= T10 CLK t CK High CKE Begin Auto Begin Auto Precharge Precharge Bank B Bank A CS# RAS# CAS# ...

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Figure 22. Full Page Random Column Read T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAx RBx RAx A0-A9 RAx RBx CAx DQM t t RCD RRD ...

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Figure 23. Full Page Random Column Write T10 CLK t CK CKE CS# RAS# CAS# WE# A11 A10 RAx RAx RBx A0-A9 RAx RBx CAx DQM t t RRD RCD ...

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Figure 24. Precharge Termination of a Burst (Burst Length= Full Page, CAS# Latency= T10 CLK t CK High CKE CS# RAS# CAS# WE# A11 A10 RAx A0-A9 RAx ...

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Pin TSOP II Package Outline Drawing Information Symbol Dimension in inch Min Normal - A 0.002 A1 0.035 A2 0.008 B - c 0.82 D 0.395 E - e 0.455 HE 0.016 L ...

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Units in mm TOP VIEW A1 CORNER 1.00 MAX SEATING PLANE Etron Confidential ...

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