AD818AR Analog Devices Inc, AD818AR Datasheet - Page 4

• Manufacturer Part Number: AD818AR
• Description: IC VIDEO OPAMP 130MHZ LP 8-SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD818AR

• Slew Rate: 500 V/µs
• Mounting Type: Surface Mount
• Rohs Status: RoHS non-compliant
• Applications: Voltage Feedback
• Number Of Circuits: 1
• -3db Bandwidth: 130MHz
• Current - Supply: 7mA
• Current - Output / Channel: 50mA
• Voltage - Supply, Single/dual (±): 5 V ~ 36 V, ±2.5 V ~ 18 V
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• No. Of Amplifiers: 1
• Bandwidth: 260MHz
• No. Of Pins: 8
• Settling Time: 80ns
• Operating Temperature Max: 85°C
• Peak Reflow Compatible (260 C): No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

AD818
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Internal Power Dissipation
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ± V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ± 6 V
Output Short-Circuit Duration . . . . . . . . See Derating Curves
Storage Temperature Range (N, R) . . . . . . . . –65∞C to +125∞C
Operating Temperature Range . . . . . . . . . . . . –40∞C to +85∞C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300∞C
NOTES
1
2
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD818 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Specification is for device in free air: 8-lead plastic package,
SOIC package,
Plastic (N) . . . . . . . . . . . . . . . . . . . . . . See Derating Curves
Small Outline (R) . . . . . . . . . . . . . . . . . See Derating Curves
JA
= 155∞C/W.
2
–INPUT 2
+INPUT 3
1
OFFSET
NULL
1
METALLIZATION PHOTOGRAPH
JA
= 90∞C/W; 8-lead
Dimensions shown in inches and (mm)
OFFSET
NULL
8
0.0559 (1.42)
S
–4–
–V
4
Figure 3. Maximum Power Dissipation vs. Temperature
for Different Package Types
S
2.0
1.5
1.0
0.5
0
–50
–40
+V
7
S
–30
–20
6 OUTPUT
8-LEAD MINI-DIP PACKAGE
–10
AMBIENT TEMPERATURE ( C)
0
0.0523
(1.33)
10
8-LEAD SOIC PACKAGE
20
30
40
50
60
T
J
70
= 150 C
80
REV.
90
D