ADA4853-3YRUZ Analog Devices Inc, ADA4853-3YRUZ Datasheet - Page 16

• Manufacturer Part Number: ADA4853-3YRUZ
• Description: IC OPAMP VIDEO TRIPLE 14-TSSOP
• Manufacturer: Analog Devices Inc

Specifications of ADA4853-3YRUZ

• Slew Rate: 120 V/µs
• Applications: Voltage Feedback
• Output Type: Rail-to-Rail
• Number Of Circuits: 3
• -3db Bandwidth: 100MHz
• Current - Supply: 1.4mA
• Current - Output / Channel: 160mA
• Voltage - Supply, Single/dual (±): 2.65 V ~ 5 V
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Gain Bandwidth: 100MHz
• Supply Voltage Range: 2.65V To 5V
• No. Of Amplifiers: 3
• Output Current: 160mA
• Amplifier Output: Rail To Rail
• Operating Temperature Range: -40°C To +105°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADA4853-1/ADA4853-2/ADA4853-3
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADA4853-1AKSZ-R2
ADA4853-1AKSZ-R7
ADA4853-1AKSZ-RL
ADA4853-2YCPZ-R2
ADA4853-2YCPZ-RL
ADA4853-2YCPZ-RL7
ADA4853-3YCPZ-R2
ADA4853-3YCPZ-RL
ADA4853-3YCPZ-R7
ADA4853-3YRUZ
ADA4853-3YRUZ-RL
ADA4853-3YRUZ-R7
1
©2006–2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
0.10 MAX
Figure 52. 6-Lead Thin Shrink Small Outline Transistor Package [SC70]
1.00
0.90
0.70
1.35
1.25
1.15
1.30 BSC
PIN 1
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-203-AB
(KS-6)—Dimensions shown in millimeters
1
6
1
0.30
0.15
2.20
2.00
1.80
5
2
1
1
1
1
1
1
1
1
1
1
1
4
3
Temperature
Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
0.65 BSC
SEATING
PLANE
1.10
0.80
2.40
2.10
1.80
INDICATOR
SEATING
PLANE
0.90
0.85
0.80
3 mm × 3 mm Body, Very Thin Quad (CP-16-3)—Dimensions shown in millimeters
PIN 1
12° MAX
D05884-0-10/07(C)
0.40
0.10
Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
0.22
0.08
Package Description
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
14-Lead Thin Shrink Small Outline Package (TSSOP)
14-Lead Thin Shrink Small Outline Package (TSSOP)
14-Lead Thin Shrink Small Outline Package (TSSOP)
BSC SQ
0.30
0.23
0.18
VIEW
3.00
TOP
* COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
BSC SQ
0.46
0.36
0.26
0.20 REF
2.75
0.80 MAX
0.65 TYP
Rev. C | Page 16 of 16
0.05 MAX
0.02 NOM
0.45
BSC
0.50
1.50 REF
0.60 MAX
1.05
1.00
0.80
4.50
4.40
4.30
PIN 1
12
9
Figure 53. 14-Lead Thin Shrink Small Outline Package [TSSOP]
13
(BOTTOM VIEW)
8
EXPOSED
0.15
0.05
PAD
14
1
BSC
0.65
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
16
(RU-14)—Dimensions shown in millimeters
5
0.30
0.19
5.10
5.00
4.90
1
4
0.50
0.40
0.30
8
7
SEATING
PLANE
0.25 MIN
* 1.65
1.50 SQ
1.35
BSC
6.40
1.20
MAX
Ordering
Quantity
250
3,000
10,000
250
5,000
1,500
250
5,000
1,500
96
2,500
1,000
COPLANARITY
0.20
0.09
0.10
Package
Option
KS-6
KS-6
KS-6
CP-16-3
CP-16-3
CP-16-3
CP-16-3
CP-16-3
CP-16-3
RU-14
RU-14
RU-14
8°
0°
Branding
HEC
HEC
HEC
H0H
H0H
H0H
H0L
H0L
H0L
0.75
0.60
0.45