ISL59833IAZ Intersil, ISL59833IAZ Datasheet - Page 14

• Manufacturer Part Number: ISL59833IAZ
• Description: IC VIDEO DRIVER TRUE SGL 16-QSOP
• Manufacturer: Intersil

Specifications of ISL59833IAZ

• Applications: Voltage Feedback
• Output Type: Rail-to-Rail
• Number Of Circuits: 3
• -3db Bandwidth: 200MHz
• Slew Rate: 500 V/µs
• Current - Supply: 97mA
• Current - Output / Channel: 80mA
• Voltage - Supply, Single/dual (±): 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Package / Case: 16-QSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

current never exceeds ±40mA, after which the electro-
migration limit of the process will be exceeded and the part
will be damaged. This limit is set by the design of the internal
metal interconnections.
POWER DISSIPATION
With the high output drive capability of the ISL59837, it is
possible to exceed the
temperature under certain load current conditions.
Therefore, it is important to calculate the maximum junction
temperature for an application to determine if load conditions
or package types need to be modified to assure operation of
the amplifier in a safe operating area.
The maximum power dissipation allowed in a package is
determined according to:
PD
Where:
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the load, or:
for sourcing:
for sinking:
PD
PD
T
T
Θ
MAX
AMAX
MAX
MAX
JMAX
JA
= Thermal resistance of the package
=
=
=
= Maximum junction temperature
= Maximum ambient temperature
T
-------------------------------------------- -
V
V
JMAX
S
S
×
×
I
I
Θ
SMAX
SMAX
–
JA
T
AMAX
+
+
+
(
(
V
V
150°C absolute maximum junction
S
OUT
–
14
V
i V
OUT
–
S
i
)
)
×
×
I
V
-----------------
LOAD
OUT
R
L
i
i
i
(EQ. 1)
(EQ. 2)
(EQ. 3)
ISL59833
Where:
By setting the two P
can solve the output current and R
overheat.
Power Supply Bypassing and Printed Circuit
Board Layout
Strip line design techniques are recommended for the input
and output signal traces. As with any high frequency device,
a good printed circuit board layout is necessary for optimum
performance. Lead lengths should be as short as possible.
The power supply pin must be well bypassed to reduce the
risk of oscillation. For normal single supply operation, where
the V
tantalum capacitor in parallel with a 0.1µF ceramic capacitor
from V
combination should be placed at each supply pin to ground if
split-internal supplies are to be used. In this case, the V
pin becomes the negative supply rail.
For good AC performance, parasitic capacitance should be
kept to a minimum. Use of wire-wound resistors should be
avoided because of their additional series inductance. Use
of sockets should also be avoided if possible. Sockets add
parasitic inductance and capacitance can result in
compromised performance. Minimizing parasitic capacitance
at the amplifier's inverting input pin is also very important.
V
I
V
R
I
i = Number of output channels
SMAX
LOAD
S
OUT
LOAD
S
= Supply voltage
- pin is connected to the ground plane, a single 4.7µF
S
+ to GND will suffice. This same capacitor
= Maximum output voltage of the application
= Load current
= Maximum quiescent supply current
= Load resistance tied to ground
DMAX
equations equal to each other, we
LOAD
to avoid the device
March 5, 2007
FN6334.1
S
-