NCS2211DR2G ON Semiconductor, NCS2211DR2G Datasheet - Page 2

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NCS2211DR2G

Manufacturer Part Number
NCS2211DR2G
Description
IC AMP AUDIO DIFF OUT SD 8-SOIC
Manufacturer
ON Semiconductor
Type
Class ABr
Datasheet

Specifications of NCS2211DR2G

Output Type
1-Channel (Mono)
Max Output Power X Channels @ Load
1.5W x 1 @ 4 Ohm
Voltage - Supply
2.7 V ~ 5.5 V
Features
Shutdown
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Operational Class
Class-AB
Audio Amplifier Output Configuration
1-Channel Mono
Output Power (typ)
1x1@8OhmW
Audio Amplifier Function
Speaker
Single Supply Voltage (typ)
3/5V
Dual Supply Voltage (typ)
Not RequiredV
Supply Current (max)
20@5.5V@-40C to 85CmA
Power Supply Requirement
Single
Unity Gain Bandwidth Product (typ)
12MHz
Rail/rail I/o Type
No
Power Supply Rejection Ratio
75dB
Single Supply Voltage (min)
2.7V
Single Supply Voltage (max)
5.5V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NCS2211DR2G
Manufacturer:
ON Semiconductor
Quantity:
500
Part Number:
NCS2211DR2G
Manufacturer:
ON
Quantity:
10 000
Part Number:
NCS2211DR2G
Manufacturer:
ON/安森美
Quantity:
20 000
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. Power dissipation must be considered to ensure maximum junction temperature (T
3. For additional information, see Application Note AND8003/D
4. As mounted on an 80x80x1.5 mm FR4 PCB with 650 mm
MAXIMUM RATINGS
Power Supply Voltages
Output Current
Maximum Junction Temperature (Note 2)
Operating Ambient Temperature
Storage Temperature Range
Power Dissipation
Thermal Resistance, Junction−to−Air − SOIC−8
Thermal Resistance, Junction−to−Air
Moisture Sensitivity (Note 3)
51.1, 51.2, 51.3 test guidelines.
1. Enable (pin 1) must be actively driven for proper operation and cannot be left floating. See
Enable (Note 1)
ENABLE/SHUTDOWN CONTROL in the specification table for proper logic threshold levels.
(−) Input
Parameter
(+) Input
− DFN8 (Note 4)
C1
C2
PIN CONNECTIONS for SOIC−8 and DFN8
R1
Filtering
Bias
Enable
4
3
2
Bias
Figure 1. Block Diagram
IN+
IN−
Shutdown
http://onsemi.com
2
R
R
High
1
2
3
4
and 2 oz (0.034 mm) thick copper heat spreader. Following JEDEC JESD/EIA
V
V
CC
(Top View)
EE
7
+
+
6
2
1
R
R
8
7
6
5
Enable
OUT−
V
V
OUT+
Output (+)
Output (−)
EE
CC
5
8
Symbol
R2
J
V
) is not exceeded.
T
q
P
T
T
I
CC
stg
O
JA
A
D
J
Enabled
R
Low
L
(See Graph)
−60 to +150
−40 to +85
Level 1
Rating
500
150
117
5.5
70
°C/W
Unit
Vdc
mW
mA
°C
°C
°C

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