CXK5T16100TM-12LLX Sony, CXK5T16100TM-12LLX Datasheet
CXK5T16100TM-12LLX
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CXK5T16100TM-12LLX Summary of contents
Page 1
... CMOS static RAM organized as 65536- words by 16-bits. Special feature are low power consumption and high speed. The CXK5T16100TM is a suitable RAM for portable equipment with battery back up. Features • Extended operating temperature range: –25 to +85°C • Wide supply voltage range operation: 2.7 to 3.6V • ...
Page 2
... Ground No connection °C °C I/O9 to I/O16 I Not selected I Read I High-Z I Read I Write I Not Write/Hi-Z I Write I High-Z I High-Z CXK5T16100TM Vcc Current , I SB1 SB2 , CC1 CC2 CC3 , CC1 CC2 CC3 , CC1 CC2 CC3 , CC1 CC2 CC3 , CC1 ...
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... 0mA = 0mA = 0mA ≤ 0.2V ≥ V – 0.2V CC –25 to +85°C – 0.2V –25 to +70°C CC +25° –2.0mA = 2.0mA – 3 – CXK5T16100TM (Ta = –25 to +85°C, GND = 0V 3.3V ± 0.3V CC Min. Typ. Max. 3.0 3.3 3.6 2.0 — –0.3 — 0.8 = 2.7 to 3.6V, GND = 0V –25 to +85°C) 2 Min ...
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... Min. Typ — — — — I/O (Ta = –25 to +85°C) Conditions V = 2 3.3V ± 5ns r = 5ns 5ns f = 5ns 1.4V 1. 100pF, 1TTL C = 100pF, 1TTL – 4 – CXK5T16100TM Max. Unit TTL C L ...
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... — — — — — WR1 t 5 — WHZ 2 — 40 – 5 – CXK5T16100TM = 3.3V ± 0.3V Unit Max. ns — ns — 100 ns — 100 — — — — — — ns — — ...
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... Previous data valid Data out • Read cycle ( Address CE UB Data out High impedance , and Data valid BLZ OLZ Data valid – 6 – CXK5T16100TM BHZ t OHZ ...
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... Write cycle ( control Address Data in Data out Data valid t WHZ High impedance ( Data valid High impedance – 7 – CXK5T16100TM WR1 t DH ...
Page 8
... I/ tested from either the rising edge LB, whichever comes earlier, until the end WR1 of the write cycle. t (for I/O9 to 16) is tested from either the rising edge UB, whichever comes earlier, until the end WR1 of the write cycle Data valid High impedance – 8 – CXK5T16100TM t WR1 ( ...
Page 9
... Data retention mode CDRS CE V – 0.2V CC Test condition CE ≥ V – 0.2V CC –25 to +85°C –25 to +70° 3.0V CC +25° 2.0 to 3.6V CC Chip disable to data retention mode – 9 – CXK5T16100TM t R (Ta = –25 to +85°C) Min. Typ. Max. Unit 2.0 — 3.6 V — — 24 — — 12 µA — 0.4 — ...
Page 10
... JEDEC CODE 44PIN TSOP (II) (PLASTIC) 400mil NOTE: Dimension “ ” does not include mold protrusion. PACKAGE STRUCTURE MOLDING COMPOUND LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT – 10 – CXK5T16100TM 1.2 MAX 0 0.1 0.1 – 0.05 0° to 10° DETAIL A EPOXY / PHENOL RESIN SOLDER PLATING 42 ALLOY 0.5g ...