LM4890IBP National Semiconductor, LM4890IBP Datasheet - Page 4

• Manufacturer Part Number: LM4890IBP
• Description: IC AMP AUDIO PWR 1W MONO 8USMD
• Manufacturer: National Semiconductor
• Series: Boomer®r
• Type: Class ABr

Specifications of LM4890IBP

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 1W x 1 @ 8 Ohm
• Voltage - Supply: 2.2 V ~ 5.5 V
• Features: Depop, Shutdown, Thermal Protection
• Mounting Type: Surface Mount
• Package / Case: 8-MicroSMD
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: LM4890IBPTR

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I
I
V
V
V
R
P
T
T
THD+N
PSRR
T
I
I
V
V
V
R
T
DD
SD
DD
SD
Symbol
Symbol
WU
SD
SDT
WU
SDIH
SDIL
OS
o
SDIH
SDIL
OS
OUT-GND
OUT-GND
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Electrical Characteristics V
The following specifications apply for the circuit shown in Figure 1 unless otherwise specified. Limits apply for T
Electrical Characteristics V
The following specifications apply for the circuit shown in Figure 1 unless otherwise specified. Limits apply for T
Supply Voltage (Note 11)
Storage Temperature
Input Voltage
Power Dissipation (Note 3)
ESD Susceptibility (Note 4)
Junction Temperature
Thermal Resistance
θ
θ
θ
JC
JA
JA
(SOP)
(SOP)
(8 Bump micro SMD, Note 12)
Quiescent Power Supply Current
Shutdown Current
Shutdown Voltage Input High
Shutdown Voltage Input Low
Output Offset Voltage
Resistor Output to GND (Note 10)
Output Power (8Ω)
Wake-up time
Thermal Shutdown Temperature
Total Harmonic Distortion + Noise
Power Supply Rejection Ratio
(Note 14)
Shut Down Time
Quiescent Power Supply Current
Shutdown Current
Shutdown Voltage Input High
Shutdown Voltage Input Low
Output Offset Voltage
Resistor Output to Gnd (Note 10)
Wake-up time
Parameter
Parameter
−0.3V to V
Internally Limited
−65˚C to +150˚C
DD
DD
V
V
V
THD = 2% (max); f = 1 kHz
P
V
Input Terminated with 10 ohms to
ground
8 Ω load
V
V
V
(Note 2)
IN
IN
SHUTDOWN
o
ripple
IN
IN
SHUTDOWN
= 0.4 Wrms; f = 1kHz
= 5V
= 3V
DD
= 0V, I
= 0V, I
= 0V, I
= 0V, I
150˚C/W
220˚C/W
35˚C/W
= 200mV sine p-p
2000V
150˚C
+0.3V
6.0V
o
o
o
o
Conditions
Conditions
= 0A, No Load
= 0A, 8Ω Load
= 0A, No Load
= 0A, 8Ω Load
= 0V
= 0V
(Notes 1, 2, 8)
(Notes 1, 2, 8)
4
Operating Ratings
Soldering Information
See AN-1112 "microSMD Wafers Level Chip Scale
Package."
See AN-1187 "Leadless Leadframe Package (LLP)."
Temperature Range
Supply Voltage
θ
θ
θ
θ
T
JA
JC
JA
JA
MIN
(9 Bump micro SMD, Note 12)
(MSOP)
(MSOP)
(LLP)
≤ T
A
≤ T
MAX
66 (f = 1kHz)
(Note 6)
(Note 6)
Typical
Typical
217Hz)
62 (f =
170
170
120
0.1
8.5
1.0
0.1
1.0
3.5
4.5
0.1
8.5
4
5
7
7
LM4890
LM4890
(Notes 7, 9)
(Notes 7, 9)
Limit
Limit
220
150
190
180
2.0
1.2
0.4
9.7
7.0
0.8
2.0
1.2
0.4
9.7
7.0
10
50
55
50
8
7
9
−40˚C ≤ T
2.2V ≤ V
A
A
= 25˚C.
= 25˚C.
mA (max)
mA (max)
mV (max)
mA (max)
mA (max)
mV (max)
ms (max)
ms (max)
ms (max)
µA (max)
kΩ (max)
µA (max)
kΩ (max)
DD
˚C (max)
kΩ (min)
dB (min)
kΩ (min)
˚C (min)
(Limits)
V (max)
(Limits)
V (min)
V(max)
180˚C/W
190˚C/W
220˚C/W
A
V(min)
Units
Units
56˚C/W
≤ 85˚C
≤ 5.5V
W
%