This notice is to inform you of a change that will be made to certain ADI products (see Material Report). Any issues with this PCN or requirements to
qualify the change (additional data or samples) must be sent to ADI within 30 days of receiving this notification. ADI contact information is listed
below.
Revision Description*:
PCN Title:
Publication Date:
Samples Available Date:
Effectivity Date:
Description Of Change
Reason For Change
Anticipated impact of the change (positive or negative) on fit, form, function & reliability
Product Identification (this section will describe how to identify the changed material)
Summary of Supporting Information
Comments
Initial Release
1) Process Changed from ECL to HVBP2
2) Fab location change from ADI Santa Clara CA, to ADI Limerick, Ireland
3) Wafer Size Changed from 4" to 8"
4) Circuit layout and topology changed to meet new process design rules and existing product performance criteria.
5) Requires changes to external passive component values (vs previous die revision) to achieve similar output response vs input signals.
1) Product was originally designed and manufactured on the ECL technology platform which was obsoleted with the Analog Device closure of the 4" wafer
Fab facility in Santa Clara CA.
2) The new die provides for ongoing manufacture and supply of SSM2166 to existing and new customers
3) Re-design of the product was required to allow manufacture using the new fab process.
Customers using the previous version of SSM2166 will need to change external passive component values to achieve similar I/O response when using the new
die version. Recommended external component values for the new version are given in the revised datasheet rev D or later.
An "A" Indentifier has been added to the part name on the top mark. (See Examples of top mark below)
PB-Free
Top #1: SSM
Top #2: 2166A
Top #3: #
SnPb
Top #1: SSM
Top #2: 2166A
Top #3:
Qualification was performed per ADI0012. Reliability Report 6956 - SSM2166 Die Revision is attached
Final Die Revision was released in July of 2008. This was a follow-up notification of change. Customers with active backlog and/or recent buying history were
contacted during the redesign process, prior to shipment of the new die revision.
Supporting Documents
Attachment 1: ADI_PCN_08_0152_Rev_-_Reliability Report 6956.pdf
Product/Process Change Notice - PCN 08_0152 Rev. -
Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106
SSM2166, New Design and Conversion to new wafer fabrication process
24-Mar-2009
08-Dec-2008
08-Dec-2008 (the earliest date that a customer could expect to receive changed material)
Analog Devices, Inc. PCN 08_0152_Rev_- Page 1 of 4