XPC8255AZUIFBA Freescale Semiconductor, Inc, XPC8255AZUIFBA Datasheet

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XPC8255AZUIFBA

Manufacturer Part Number
XPC8255AZUIFBA
Description
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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XPC8255AZUIFBA
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MOTOLOLA
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748
Freescale Semiconductor
Technical Data
MPC8260A
PowerQUICC™ II Integrated
Communications Processor
Hardware Specifications
This document contains detailed information on power
considerations, DC/AC electrical characteristics, and AC
timing specifications for .25µm (HiP4) devices in the
PowerQUICC II™ MPC8260 communications processor
family. These devices include the MPC8260, the MPC8255,
the MPC8264, the MPC8265, and the MPC8266.
Throughout this document, these devices are collectively
referred to as the MPC826xA.
© Freescale Semiconductor, Inc., 2003, 2006. All rights reserved.
1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Electrical and Thermal Characteristics . . . . . . . . . . . . 7
3. Clock Configuration Modes . . . . . . . . . . . . . . . . . . . 23
4. Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5. Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 46
6. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 48
7. Document Revision History . . . . . . . . . . . . . . . . . . . 48
Document Number: MPC8260AEC
Contents
Rev. 1.1, 03/2006

Related parts for XPC8255AZUIFBA

XPC8255AZUIFBA Summary of contents

Page 1

... These devices include the MPC8260, the MPC8255, the MPC8264, the MPC8265, and the MPC8266. Throughout this document, these devices are collectively referred to as the MPC826xA. © Freescale Semiconductor, Inc., 2003, 2006. All rights reserved. Document Number: MPC8260AEC Rev. 1.1, 03/2006 Contents 1 ...

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Features Figure 1 shows the block diagram for the MPC8266, the HiP4 superset device. Shaded portions indicate functionality that is not available on all devices; refer to the notes. G2 Core Communication Processor Module (CPM) Timers Interrupt Controller Parallel I/O ...

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PowerPC architecture-compliant memory management unit (MMU) — Common on-chip processor (COP) test interface — High-performance (6.6–7.65 SPEC95 benchmark at 300 MHz; 1.68 MIPs/MHz without inlining and 1.90 Dhrystones MIPS/MHz with — Supports bus snooping for data cache coherency — ...

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Features — 32-bit address decodes with programmable bank size — Three user programmable machines, general-purpose chip-select machine, and page-mode pipeline SDRAM machine — Byte selects for 64 bus width (60x) and byte selects for 32 bus width (local) — Dedicated ...

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Transparent – UART (low-speed operation) — One serial peripheral interface identical to the MPC860 SPI — One inter-integrated circuit (I – Microwire compatible – Multiple-master, single-master, and slave modes — eight TDM interfaces (four on the MPC8255) ...

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Features - Coset removing (programmable by the user) - Filtering idle/unassigned cells (programmable by the user) - Performing HEC error detection and single bit error correction (programmable by user) - Generating loss of cell delineation status/interrupt (LOC/LCD) — Operates with ...

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Hot-Swap friendly (supports the Hot Swap Specification as defined by PICMG 2.1 R1.0 August 3, 1998) — Support for 66 MHz, 3.3 V specification — 60x-PCI bus core logic which uses a buffer pool to allocate buffers for each ...

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Electrical and Thermal Characteristics Table 2 lists recommended operational voltage conditions. Table 2. Recommended Operating Conditions Rating Core supply voltage PLL supply voltage I/O supply voltage Input voltage Junction temperature (maximum) Ambient temperature Notes: 1. Caution: These are the recommended ...

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Table 3 shows DC electrical characteristics. Characteristic Input high voltage, all inputs except CLKIN Input low voltage CLKIN input high voltage CLKIN input low voltage Input leakage current VDDH IN Hi-Z (off state) leakage current, V Signal low ...

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Electrical and Thermal Characteristics Table 3. DC Electrical Characteristics Characteristic I = 7.0mA ABB/IRQ2 TS A[0-31] TT[0-4] TBST TSIZE[0–3] AACK ARTRY DBG DBB/IRQ3 D[0-63] DP(0)/RSRV/EXT_BR2 DP(1)/IRQ1/EXT_BG2 DP(2)/TLBISYNC/IRQ2/EXT_DBG2 DP(3)/IRQ3/EXT_BR3/CKSTP_OUT DP(4)/IRQ4/EXT_BG3/CORE_SREST DP(5)/TBEN/IRQ5/EXT_DBG3 DP(6)/CSE(0)/IRQ6 DP(7)/CSE(1)/IRQ7 PSDVAL TA TEA GBL/IRQ1 CI/BADDR29/IRQ2 ...

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Table 3. DC Electrical Characteristics Characteristic I = 5.3mA OL CS[0-9] CS(10)/BCTL1 CS(11)/AP(0) BADDR[27–28] ALE BCTL0 PWE(0:7)/PSDDQM(0:7)/PBS(0:7) PSDA10/PGPL0 PSDWE/PGPL1 POE/PSDRAS/PGPL2 PSDCAS/PGPL3 PGTA/PUPMWAIT/PGPL4/PPBS PSDAMUX/PGPL5 LWE[0–3]LSDDQM[0–3]/LBS[0–3]/PCI_CFG[0–3 LSDA10/LGPL0/PCI_MODCKH0 LSDWE/LGPL1/PCI_MODCKH1 LOE/LSDRAS/LGPL2/PCI_MODCKH2 LSDCAS/LGPL3/PCI_MODCKH3 LGTA/LUPMWAIT/LGPL4/LPBS LSDAMUX/LGPL5/PCI_MODCK LWR MODCK1/AP(1)/TC(0)/BNKSEL(0) MODCK2/AP(2)/TC(1)/BNKSEL(1) MODCK3/AP(3)/TC(2)/BNKSEL( 3.2mA OL 3 L_A14/PAR ...

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Electrical and Thermal Characteristics Notes: 1. The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC current recommended to either pull unused pins to GND or VDDH configure them ...

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P = K/(T + 273° Solving equations (1) and (2) for K gives 273° where constant pertaining to the particular part. K can be ...

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Electrical and Thermal Characteristics Notes: 1. Test temperature = room temperature ( Watts INT DD DD 2.4 AC Electrical Characteristics The following sections include illustrations and tables of clock diagrams, signals, and CPM outputs ...

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Table 8 lists CPM input characteristics. Table 8. AC Characteristics for CPM Inputs Spec Number Max Min sp16a sp17a FCC inputs—internal clock (NMSI) sp16b sp17b FCC inputs—external clock (NMSI) sp20 sp21 TDM inputs/SI sp18a sp19a SCC/SMC/SPI/I2C inputs—internal clock (NMSI) sp18b ...

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Electrical and Thermal Characteristics Figure 4 shows the FCC internal clock. BRG_OUT sp16a FCC input signals FCC output signals Note: When GFMR[TCI FCC output signals Note: When GFMR[TCI Figure 5 shows the SCC/SMC/SPI/I Serial CLKin SCC/SMC/SPI/I2C ...

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Figure 6 shows the SCC/SMC/SPI/I BRG_OUT SCC/SMC/SPI/I2C input signals (See note.) SCC/SMC/SPI/I2C output signals (See note.) Note: There are four possible timing conditions for SCC and SPI: 1. Input sampled on the rising edge and output driven on the rising ...

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Electrical and Thermal Characteristics Figure 8 shows PIO, timer, and DMA signals. PIO/IDMA/TIMER[TGATE assertion] input signals TIMER input signal [TGATE deassertion] IDMA output signals TIMER(sp42/43)/ PIO(sp42a/sp43a) Note: TGATE is asserted on the rising edge of the clock deasserted ...

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Table 10 lists SIU output characteristics. Table 10. AC Characteristics for SIU Outputs Spec Number Max Min sp31 sp30 PSDVAL/TEA/TA sp32 sp30 ADD/ADD_atr./BADDR/CI/GBL/WT sp33a sp30 Data bus sp33b sp30 DP sp34 sp30 Memory controller signals/ALE sp35 sp30 All other signals ...

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Electrical and Thermal Characteristics Figure 9 shows the interaction of several bus signals. CLKin AACK/ARTRY/TA/TS/TEA/ DBG/BG/BR input signals DATA bus normal mode input signal All other input signals PSDVAL/TEA/TA output signals ADD/ADD_atr/BADDR/CI/ GBL/WT output signals DATA bus output signals All ...

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Figure 11 shows signal behavior in MEMC mode. CLKin V_CLK Memory controller signals Generally, all MPC826xA bus and system output signals are driven from the rising edge of the input clock (CLKin). Memory controller signals, however, trigger on four points ...

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Electrical and Thermal Characteristics Table 12 lists the JTAG timings. Parameter JTAG external clock frequency of operation JTAG external clock cycle time JTAG external clock pulse width measured at 1.4V JTAG external clock rise and fall times TRST assert time ...

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Clock Configuration Modes To configure the main PLL multiplication factor and the core, CPM, and 60x bus frequencies, the MODCK[1–3] pins are sampled while HRESET is asserted. modes. Table 14 lists the other modes that are available by using ...

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Clock Configuration Modes Table 14. Clock Configuration Modes Input Clock MODCK_H–MODCK[1–3] Frequency 0001_101 33 MHz 0001_110 33 MHz 0001_111 33 MHz 0010_000 33 MHz 0010_001 33 MHz 0010_010 33 MHz 0010_011 33 MHz 0010_100 33 MHz 0010_101 33 MHz 0010_110 ...

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Table 14. Clock Configuration Modes Input Clock MODCK_H–MODCK[1–3] Frequency 0100_111 0101_000 0101_001 0101_010 0101_011 0101_100 0101_101 66 MHz 0101_110 66 MHz 0101_111 66 MHz 0110_000 66 MHz 0110_001 66 MHz 0110_010 66 MHz 0110_011 66 MHz 0110_100 66 MHz 0110_101 ...

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Clock Configuration Modes Table 14. Clock Configuration Modes Input Clock MODCK_H–MODCK[1–3] Frequency 1000_001 66 MHz 1000_010 66 MHz 1000_011 66 MHz 1000_100 66 MHz Notes: 1. Because of speed dependencies, not all of the possible configurations in 2. The user ...

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PCI Host Mode The frequencies listed in Table 16 a mode and input bus frequency so that the resulting configuration does not exceed the frequency rating of the user’s device. I Table 16. Clock Default Configurations in PCI Host ...

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Clock Configuration Modes Table 17. Clock Configuration Modes in PCI Host Mode (continued) Input Clock MODCK_H – (1) Frequency Multiplication MODCK[1–3] (Bus) 3 0011_010 33 MHz 3 0011_011 33 MHz 3 0100_000 33 MHz 3 0100_001 33 MHz 3 0100_010 ...

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Table 17. Clock Configuration Modes in PCI Host Mode (continued) Input Clock MODCK_H – (1) Frequency Multiplication MODCK[1–3] (Bus) 1001_001 66 MHz 1001_010 66 MHz 1001_011 66 MHz 1001_100 66 MHz 1010_000 100 MHz 1010_001 100 MHz 1010_010 100 MHz ...

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Clock Configuration Modes Table 18. Clock Default Configurations in PCI Agent Mode (MODCK_HI = 0000) (continued) Input Clock MODCK[1–3] Frequency Multiplication (1) 2 (PCI) 100 66/33 MHz 101 66/33 MHz 110 66/33 MHz 111 66/33 MHz Notes: 1. Assumes MODCK_HI ...

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Table 19. Clock Configuration Modes in PCI Agent Mode (continued) Input Clock MODCK_H – Frequency Multiplication MODCK[1–3] (1),(2) (PCI) 0100_011 66/33 MHz 0100_100 66/33 MHz (5) 0101_000 33 MHz 5 0101_001 33 MHz 5 0101_010 33 MHz 5 0101_011 33 ...

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Clock Configuration Modes Table 19. Clock Configuration Modes in PCI Agent Mode (continued) Input Clock MODCK_H – Frequency Multiplication MODCK[1–3] (1),(2) (PCI) 1010_000 66/33 MHz 1010_001 66/33 MHz 1010_010 66/33 MHz 1010_011 66/33 MHz 1010_100 66/33 MHz 1011_000 66/33 MHz ...

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Pinout This section provides the pin assignments and pinout list for the MPC826xA. 4.1 Pin Assignments Figure 13 shows the pinout of the MPC826xA’s 480 TBGA package as viewed from the top surface ...

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Pinout Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view. Copper Heat Spreader (Oxidized for Insulation) Polymide Tape Soldermask 1.27 mm Pitch Table 20 shows the pinout list of the ...

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A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 TT0 TT1 TT2 TT3 TT4 TBST TSIZ0 TSIZ1 TSIZ2 TSIZ3 AACK ARTRY DBG DBB/IRQ3 MPC8260A PowerQUICC™ II Integrated Communications ...

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Pinout D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 D32 D33 D34 D35 D36 D37 D38 D39 D40 D41 MPC8260A PowerQUICC™ II Integrated ...

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D42 D43 D44 D45 D46 D47 D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 D60 D61 D62 D63 DP0/RSRV/EXT_BR2 IRQ1/DP1/EXT_BG2 IRQ2/DP2/TLBISYNC/EXT_DBG2 IRQ3/DP3/CKSTP_OUT/EXT_BR3 IRQ4/DP4/CORE_SRESET/EXT_BG3 IRQ5/DP5/TBEN/EXT_DBG3 IRQ6/DP6/CSE0 IRQ7/DP7/CSE1 PSDVAL TA TEA GBL/IRQ1 CI/BADDR29/IRQ2 MPC8260A PowerQUICC™ II Integrated Communications ...

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Pinout WT/BADDR30/IRQ3 L2_HIT/IRQ4 CPU_BG/BADDR31/IRQ5 CPU_DBG CPU_BR CS0 CS1 CS2 CS3 CS4 CS5 CS6 CS7 CS8 CS9 CS10/BCTL1 CS11/AP0 BADDR27 BADDR28 ALE BCTL0 PWE0/PSDDQM0/PBS0 PWE1/PSDDQM1/PBS1 PWE2/PSDDQM2/PBS2 PWE3/PSDDQM3/PBS3 PWE4/PSDDQM4/PBS4 PWE5/PSDDQM5/PBS5 PWE6/PSDDQM6/PBS6 PWE7/PSDDQM7/PBS7 PSDA10/PGPL0 PSDWE/PGPL1 POE/PSDRAS/PGPL2 PSDCAS/PGPL3 PGTA/PUPMWAIT/PGPL4/PPBS PSDAMUX/PGPL5 MPC8260A PowerQUICC™ II Integrated ...

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LWE0/LSDDQM0/LBS0/PCI_CFG0 LWE1/LSDDQM1/LBS1/PCI_CFG1 LWE2/LSDDQM2/LBS2/PCI_CFG2 LWE3/LSDDQM3/LBS3/PCI_CFG3 LSDA10/LGPL0/PCI_MODCKH0 1 LSDWE/LGPL1/PCI_MODCKH1 LOE/LSDRAS/LGPL2/PCI_MODCKH2 LSDCAS/LGPL3/PCI_MODCKH3 LGTA/LUPMWAIT/LGPL4/LPBS 1 LGPL5/LSDAMUX/PCI_MODCK LWR 1 L_A14/PAR 1 L_A15/FRAME /SMI 1 L_A16/TRDY 1 L_A17/IRDY /CKSTP_OUT 1 L_A18/STOP 1 L_A19/DEVSEL 1 L_A20/IDSEL 1 L_A21/PERR 1 L_A22/SERR 1 L_A23/REQ0 1 1 L_A24/REQ1 /HSEJSW 1 ...

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Pinout 1 LCL_D6/AD6 1 LCL_D7/AD7 1 LCL_D8/AD8 1 LCL_D9/AD9 1 LCL_D10/AD10 1 LCL_D11/AD11 1 LCL_D12/AD12 1 LCL_D13/AD13 1 LCL_D14/AD14 1 LCL_D15/AD15 1 LCL_D16/AD16 1 LCL_D17/AD17 1 LCL_D18/AD18 1 LCL_D19/AD19 1 LCL_D20/AD20 1 LCL_D21/AD21 1 LCL_D22/AD22 1 LCL_D23/AD23 1 LCL_D24/AD24 1 ...

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TDI TDO TRIS PORESET HRESET SRESET QREQ RSTCONF MODCK1/AP1/TC0/BNKSEL0 MODCK2/AP2/TC1/BNKSEL1 MODCK3/AP3/TC2/BNKSEL2 XFC CLKIN1 PA0/RESTART1/DREQ3/FCC2_UTM_TXADDR2 PA1/REJECT1/FCC2_UTM_TXADDR1/DONE3 PA2/CLK20/FCC2_UTM_TXADDR0/DACK3 PA3/CLK19/FCC2_UTM_RXADDR0/DACK4/L1RXD1A2 PA4/REJECT2/FCC2_UTM_RXADDR1/DONE4 PA5/RESTART2/DREQ4/FCC2_UTM_RXADDR2 PA6/L1RSYNCA1 PA7/SMSYN2/L1TSYNCA1/L1GNTA1 PA8/SMRXD2/L1RXD0A1/L1RXDA1 PA9/SMTXD2/L1TXD0A1 PA10/FCC1_UT8_RXD0/FCC1_UT16_RXD8/MSNUM5 PA11/FCC1_UT8_RXD1/FCC1_UT16_RXD9/MSNUM4 PA12/FCC1_UT8_RXD2/FCC1_UT16_RXD10/MSNUM3 PA13/FCC1_UT8_RXD3/FCC1_UT16_RXD11/MSNUM2 PA14/FCC1_UT8_RXD4/FCC1_UT16_RXD12/FCC1_RXD3 PA15/FCC1_UT8_RXD5/FCC1_UT16_RXD13/FCC1_RXD2 PA16/FCC1_UT8_RXD6/FCC1_UT16_RXD14/FCC1_RXD1 PA17/FCC1_UT8_RXD7/FCC1_UT16_RXD15/FCC1_RXD0/FCC1_RXD PA18/FCC1_UT8_TXD7/FCC1_UT16_TXD15/FCC1_TXD0/FCC1_TXD PA19/FCC1_UT8_TXD6/FCC1_UT16_TXD14/FCC1_TXD1 PA20/FCC1_UT8_TXD5/FCC1_UT16_TXD13/FCC1_TXD2 PA21/FCC1_UT8_TXD4/FCC1_UT16_TXD12/FCC1_TXD3 MPC8260A PowerQUICC™ II Integrated Communications ...

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Pinout PA22/FCC1_UT8_TXD3/FCC1_UT16_TXD11 PA23/FCC1_UT8_TXD2/FCC1_UT16_TXD10 PA24/FCC1_UT8_TXD1/FCC1_UT16_TXD9/MSNUM1 PA25/FCC1_UT8_TXD0/FCC1_UT16_TXD8/MSNUM0 PA26/FCC1_UTM_RXCLAV/FCC1_UTS_RXCLAV/FCC1_MII_RX_ER PA27/FCC1_UT_RXSOC/FCC1_MII_RX_DV PA28/FCC1_UTM_RXENB/FCC1_UTS_RXENB/FCC1_MII_TX_EN PA29/FCC1_UT_TXSOC/FCC1_MII_TX_ER PA30/FCC1_UTM_TXCLAV/FCC1_UTS_TXCLAV/FCC1_MII_CRS/ FCC1_RTS PA31/FCC1_UTM_TXENB/FCC1_UTS_TXENB/FCC1_MII_COL PB4/FCC3_TXD3/FCC2_UT8_RXD0/L1RSYNCA2/FCC3_RTS PB5/FCC3_TXD2/FCC2_UT8_RXD1/L1TSYNCA2/L1GNTA2 PB6/FCC3_TXD1/FCC2_UT8_RXD2/L1RXDA2/L1RXD0A2 PB7/FCC3_TXD0/FCC3_TXD/FCC2_UT8_RXD3/L1TXDA2/L1TXD0A2 PB8/FCC2_UT8_TXD3/FCC3_RXD0/FCC3_RXD/TXD3/L1RSYNCD1 PB9/FCC2_UT8_TXD2/FCC3_RXD1/L1TXD2A2/L1TSYNCD1/L1GNTD1 PB10/FCC2_UT8_TXD1/FCC3_RXD2/L1RXDD1 PB11/FCC3_RXD3/FCC2_UT8_TXD0/L1TXDD1 PB12/FCC3_MII_CRS/L1CLKOB1/L1RSYNCC1/TXD2 PB13/FCC3_MII_COL/L1RQB1/L1TSYNCC1/L1GNTC1/L1TXD1A2 PB14/FCC3_MII_TX_EN/RXD3/L1RXDC1 PB15/FCC3_MII_TX_ER/RXD2/L1TXDC1 PB16/FCC3_MII_RX_ER/L1CLKOA1/CLK18 PB17/FCC3_MII_RX_DV/L1RQA1/CLK17 PB18/FCC2_UT8_RXD4/FCC2_RXD3/L1CLKOD2/L1RXD2A2 PB19/FCC2_UT8_RXD5/FCC2_RXD2/L1RQD2/L1RXD3A2 PB20/FCC2_UT8_RXD6/FCC2_RXD1/L1RSYNCD2/L1TXD1A1 PB21/FCC2_UT8_RXD7/FCC2_RXD0/FCC2_RXD/L1TSYNCD2/L1GNTD2/ L1TXD2A1 PB22/FCC2_UT8_TXD7/FCC2_TXD0/FCC2_TXD/L1RXD1A1/L1RXDD2 PB23/FCC2_UT8_TXD6/FCC2_TXD1/L1RXD2A1/L1TXDD2 PB24/FCC2_UT8_TXD5/FCC2_TXD2/L1RXD3A1/L1RSYNCC2 PB25/FCC2_UT8_TXD4/FCC2_TXD3/L1TSYNCC2/L1GNTC2/L1TXD3A1 PB26/FCC2_MII_CRS/FCC2_UT8_TXD1/L1RXDC2 MPC8260A PowerQUICC™ II Integrated ...

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PB27/FCC2_MII_COL/FCC2_UT8_TXD0/L1TXDC2 PB28/FCC2_MII_RX_ER/FCC2_RTS/L1TSYNCB2/L1GNTB2/TXD1 PB29/FCC2_UTM_RXCLAV/FCC2_UTS_RXCLAV/L1RSYNCB2/ FCC2_MII_TX_EN PB30/FCC2_MII_RX_DV/FCC2_UT_TXSOC/L1RXDB2 PB31/FCC2_MII_TX_ER/FCC2_UT_RXSOC/L1TXDB2 PC0/DREQ1/BRGO7/SMSYN2/L1CLKOA2 PC1/DREQ2/BRGO6/L1RQA2 PC2/FCC3_CD/FCC2_UT8_TXD3/DONE2 PC3/FCC3_CTS/FCC2_UT8_TXD2/DACK2/CTS4 PC4/FCC2_UTM_RXENB/FCC2_UTS_RXENB/SI2_L1ST4/FCC2_CD PC5/FCC2_UTM_TXCLAV/FCC2_UTS_TXCLAV/SI2_L1ST3/FCC2_CTS PC6/FCC1_CD/L1CLKOC1/FCC1_UTM_RXADDR2/FCC1_UTS_RXADDR/ FCC1_UTM_RXCLAV1 PC7/FCC1_CTS/L1RQC1/FCC1_UTM_TXADDR2/FCC1_UTS_TXADDR2/ FCC1_UTM_TXCLAV1 PC8/CD4/RENA4/FCC1_UT16_TXD0/SI2_L1ST2/CTS3 PC9/CTS4/CLSN4/FCC1_UT16_TXD1/SI2_L1ST1/L1TSYNCA2/L1GNTA2 PC10/CD3/RENA3/FCC1_UT16_TXD2/SI1_L1ST4/FCC2_UT8_RXD3 PC11/CTS3/CLSN3/L1CLKOD1/L1TXD3A2/FCC2_UT8_RXD2 PC12/CD2/RENA2/SI1_L1ST3/FCC1_UTM_RXADDR1/ FCC1_UTS_RXADDR1 PC13/CTS2/CLSN2/L1RQD1/FCC1_UTM_TXADDR1/ FCC1_UTS_TXADDR1 PC14/CD1/RENA1/FCC1_UTM_RXADDR0/FCC1_UTS_RXADDR0 PC15/CTS1/CLSN1/SMTXD2/FCC1_UTM_TXADDR0/ FCC1_UTS_TXADDR0 PC16/CLK16/TIN4 PC17/CLK15/TIN3/BRGO8 PC18/CLK14/TGATE2 PC19/CLK13/BRGO7/SPICLK PC20/CLK12/TGATE1 PC21/CLK11/BRGO6 PC22/CLK10/DONE1 PC23/CLK9/BRGO5/DACK1 PC24/FCC2_UT8_TXD3/CLK8/TOUT4 PC25/FCC2_UT8_TXD2/CLK7/BRGO4 MPC8260A PowerQUICC™ II ...

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Pinout PC26/CLK6/TOUT3/TMCLK PC27/FCC3_TXD/FCC3_TXD0/CLK5/BRGO3 PC28/CLK4/TIN1/TOUT2/CTS2/CLSN2 PC29/CLK3/TIN2/BRGO2/CTS1/CLSN1 PC30/FCC2_UT8_TXD3/CLK2/TOUT1 PC31/CLK1/BRGO1 PD4/BRGO8/L1TSYNCD1/L1GNTD1/FCC3_RTS/SMRXD2 PD5/FCC1_UT16_TXD3/DONE1 PD6/FCC1_UT16_TXD4/DACK1 PD7/SMSYN1/FCC1_UTM_TXADDR3/FCC1_UTS_TXADDR3/ FCC2_UTM_TXADDR4/FCC1_TXCLAV2 PD8/SMRXD1/FCC2_UT_TXPRTY/BRGO5 PD9/SMTXD1/FCC2_UT_RXPRTY/BRGO3 PD10/L1CLKOB2/FCC2_UT8_RXD1/L1RSYNCB1/BRGO4 PD11/L1RQB2/FCC2_UT8_RXD0/L1TSYNCB1/L1GNTB1 PD12/SI1_L1ST2/L1RXDB1 PD13/SI1_L1ST1/L1TXDB1 PD14/FCC1_UT16_RXD0/L1CLKOC2/I2CSCL PD15/FCC1_UT16_RXD1/L1RQC2/I2CSDA PD16/FCC1_UT_TXPRTY/L1TSYNCC1/L1GNTC1/SPIMISO PD17/FCC1_UT_RXPRTY/BRGO2/SPIMOSI PD18/FCC1_UTM_RXADDR4/FCC1_UTS_RXADDR4/ FCC1_UTM_RXCLAV3/FCC2_UTM_RXADDR3/SPICLK PD19/FCC1_UTM_TXADDR4/FCC1_UTS_TXADDR4/ FCC1_UTM_TXCLAV3/FCC2_UTM_TXADDR3/SPISEL/BRGO1 PD20/RTS4/TENA4/FCC1_UT16_RXD2/L1RSYNCA2 PD21/TXD4/FCC1_UT16_RXD3/L1RXD0A2/L1RXDA2 PD22/RXD4/FCC1_UT16_TXD5/L1TXD0A2/L1TXDA2 PD23/RTS3/TENA3/FCC1_UT16_RXD4/L1RSYNCD1 PD24/TXD3/FCC1_UT16_RXD5/L1RXDD1 PD25/RXD3/FCC1_UT16_TXD6/L1TXDD1 PD26/RTS2/TENA2/FCC1_UT16_RXD6/L1RSYNCC1 PD27/TXD2/FCC1_UT16_RXD7/L1RXDC1 PD28/RXD2/FCC1_UT16_TXD7/L1TXDC1 PD29/RTS1/TENA1/FCC1_UTM_RXADDR3/FCC1_UTS_RXADDR3/ FCC1_UTM_RXCLAV2/FCC2_UTM_RXADDR4 MPC8260A PowerQUICC™ II ...

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PD30/FCC2_UTM_TXENB/FCC2_UTS_TXENB/TXD1 PD31/RXD1 VCCSYN VCCSYN1 GNDSYN 1,(3) CLKIN2 (4) SPARE4 1,(5) PCI_MODE 4 SPARE6 (6) THERMAL0 6 THERMAL1 I/O power Core Power Ground Notes: 1. MPC8265 and MPC8266 only. 2. The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) ...

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Package Description Symbols used in Table 20 are described in Symbol OVERBAR UTM UTS UT8 UT16 MII 5 Package Description The following sections provide the package parameters and mechanical dimensions for the MPC826xA. 5.1 Package Parameters Package parameters are provided ...

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Mechanical Dimensions Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package. Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor Package Description ...

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Ordering Information 6 Ordering Information Figure 16 provides an example of the Freescale part numbering nomenclature for the MPC826xA. In addition to the processor frequency, the part numbering scheme also consists of a part modifier that indicates any enhancement(s) in ...

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Table 23. Document Revision History (continued) Revision Date 0.3 11/2001 • Table 1: note 3 • Section 2.1: Removal of “Warning” recommending use of bootstrap diodes. They are not needed. • Table 9: Change to sp12. • Table 10: Change ...

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Document Revision History THIS PAGE INTENTIONALLY LEFT BLANK MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 50 Freescale Semiconductor ...

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THIS PAGE INTENTIONALLY LEFT BLANK MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor Document Revision History 51 ...

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... Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc., 2003, 2006. ...

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