X25F064 Intersil Corporation, X25F064 Datasheet
X25F064
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X25F064 Summary of contents
Page 1
... HOLD input, the X25F064/032/016/008 will ignore transitions on its inputs, thus allowing the host to service higher priority interrupts. The PP input can be used as a hardwire input to the X25F064/032/016/008 disabling all program attempts to the status register, thus providing a mechanism for limiting end user capa- bility of altering 0, 1/4, 1/2, or all of the memory. The X25F064/032/016/008 utilizes Xicor’ ...
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... When CS is HIGH, the X25F064/032/016/008 is deselected and the SO output pin is at high impedance and unless an internal program operation is underway the X25F064/032/016/008 will be in the standby power mode. CS LOW enables the X25F064/032/016/008, placing it in the active power mode. It should be noted that after power-up, a HIGH to LOW transition required prior to the start of any operation ...
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... CS goes LOW. SCK is static, allowing the user to stop the clock and then resume operations. If the clock line is shared with other peripheral devices on the SPI bus, the user can assert the HOLD input to place the X25F064/ 032/016/008 into a “PAUSE” condition. After releasing HOLD, the X25F064/032/016/008 device will resume operation from the point when HOLD was first asserted ...
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... PREN instruction (See Figure 3 first taken LOW, then the PREN instruction is clocked into 6685 PGM T05.2 the X25F064/032/016/008 device. After all eight bits of the instruction are transmitted, CS must then be taken HIGH. If the user continues the programming operation without taking CS HIGH after issuing the PREN instruc- tion, the programming operation will be ignored ...
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... X25F064/032/016/008 Operational Notes The device powers-up in the following state: • The device is in the low power standby state. • A HIGH to LOW transition required to enter an active state and receive an instruction. • SO pin is high impedance. • The program enable latch is reset. Figure 1. Read SerialFlash Memory Array Operation Sequence ...
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... X25F064/032/016/008 Figure 3. Program Enable Latch Sequence CS SCK INSTRUCTION HIGH IMPEDANCE 6 6685 ILL F05.1 ...
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... X25F064/032/016/008 Figure 4. Programming Sequence SCK INSTRUCTION SCK DATA BYTE Figure 5. Program Status Register Operation Sequence CS 0 SCK SI HIGH IMPEDANCE BIT ADDRESS ...
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... Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Supply Voltage Max. X25F064/032/016/008 +70 C X25F064/032/016/008–5 +85 C +85 C 6685 PGM T06.2 Limits Min. Max. Units ...
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... X25F064/032/016/008 EQUIVALENT A.C. LOAD CIRCUIT 2.7V 1.64K 1.44K OUTPUT OUTPUT 4.63K 1.95K 100pF A.C. CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified) Data Input Timing Symbol Parameter f Clock Frequency SCK t Cycle Time CYC CS Lead Time t LEAD CS Lag Time t LAG t Clock HIGH Time WH t Clock LOW Time ...
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... X25F064/032/016/008 Serial Output Timing CS SCK MSB OUT ADDR SI LSB IN Serial Input Timing CS t LEAD SCK MSB IN HIGH IMPEDANCE CYC MSB–1 OUT LAG DIS LSB OUT 6685 ILL F10 LAG t FI LSB IN ...
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... X25F064/032/016/008 Hold Timing CS SCK SO SI HOLD 6685 ILL F12 11 ...
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... X25F064/032/016/008 PACKAGING INFORMATION 8-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE P HALF SHOULDER WIDTH ON ALL END PINS OPTIONAL 0.015 (0.38) MAX. TYP. 0.010 (0.25) NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH 0.430 (10.92) 0.360 (9.14) PIN 1 INDEX PIN 1 0.300 (7.62) REF. SEATING PLANE 0.150 (3.81) ...
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... X25F064/032/016/008 PACKAGING INFORMATION 8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S PIN 1 INDEX 0.010 (0.25) 0.020 (0.50) 0 – 8 0.016 (0.410) 0.037 (0.937) NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 0.150 (3.80) 0.158 (4.00) PIN 1 0.014 (0.35) 0.019 (0.49) 0.188 (4.78) 0.197 (5.00) (4X) 7 0.004 (0.19) 0.050 (1.27) 0.010 (0.25 0.0075 (0.19) 0.250" 0.010 (0.25) ...
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... X25F064/032/016/008 PACKAGING INFORMATION 14-LEAD PLASTIC, TSSOP PACKAGE TYPE V 0 – 8 See Detail “A” NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) .025 (.65) BSC .169 (4.3) .252 (6.4) BSC .177 (4.5) .193 (4.9) .200 (5.1) .047 (1.20) .0075 (.19) .002 (.05) .0118 (.30) .006 (.15) .010 (.25) Gage Plane Seating Plane .019 (.50) .029 (.75) Detail A (20X) ...
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... X25F064/032/016/008 PACKAGING INFORMATION 20-LEAD PLASTIC, TSSOP PACKAGE TYPE V 0 – 8 See Detail “A” NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) .025 (.65) BSC .169 (4.3) .252 (6.4) BSC .177 (4.5) .252 (6.4) .300 (6.6) .047 (1.20) .0075 (.19) .002 (.05) .0118 (.30) .006 (.15) .010 (.25) Gage Plane Seating Plane .019 (.50) .029 (.75) Detail A (20X) ...
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... V CC Blank = 1. 4.5V to 5.5V Temperature Range Blank = Commercial = + Extended = – + Industrial = – +85 C Package X25F064 P = 8-Lead Plastic DIP S = 8-Lead SOIC V = 20-Lead TSSOP P = 8-Lead Plastic DIP X25FXXX Blank = 8-Lead SOIC V = 14/20-Lead TSSOP X Blank = 1.8V to 3.6V + 4.5V to 5.5V + 4.5V to 5.5V, – ...