TD62107BP TOSHIBA Semiconductor CORPORATION, TD62107BP Datasheet

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... GND terminal = heat sink l Package typeï DIPï16pin l Package typeïF : HSOPï16pin PIN CONNECTION (TOP VIEW) TD62107P / TD62107BP 80 V MIN. (TD62107BP MIN. (TD62107P MIN. (TD62107F) Weight DIP16íPí300í2.54A : 1.11 g (Typ.) HSOP16íPí300í1.00 : 0.50 g (Typ.) TD62107F 1 ...

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SCHEMATICS (EACH DRIVER) INPUT EQUIVALENT CIRCUIT MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTIC Supply Voltage P Output Sustaining Voltage BP F Output Current Input Voltage P Clamp Diode Reverse Voltage Clamp Diode Forword Current ...

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RECOMMENDED OPERATING CONDITIONS CHARACTERISTIC Supply Voltage P Output Sustaining BP Voltage Output Current Input Voltage P Clamp Diode BP ReverseVoltage Clamp Diode Forward Current Power Dissipation F ...

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ELECTRICAL CHARACTERISTICS CHARACTERISTIC "H" Level Input Voltage "L" Level P Output "H" Level BP Current Output "L" Level Voltage BP "H" Level Input Current "L" Level P Clamp Diode Reverse BP Current Clamp Diode ...

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TEST CIRCUIT CCL PRECAUTIONS for USING This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess ...

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TD62107P/BP/F 6 2001-07-16 ...

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PACKAGE DIMENSIONS DIP16íPí300í2.54A Weight: 1.11 g (Typ.) TD62107P/BP/F 7 Unit : mm 2001-07-16 ...

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PACKAGE DIMENSIONS HSOP16íPí300í1.00 Weight: 0.50 g (Typ.) TD62107P/BP/F 8 Unit : mm 2001-07-16 ...

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RESTRICTIONS ON PRODUCT USE · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress ...