NUF9002FC
Low Capacitance 10 Line
EMI Filter with ESD
Protection
Greater than −25 dB attenuation is obtained at frequencies from
900 MHz to 3.0 GHz. ESD protection is provided across all
capacitors.
Features
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Benefits
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Applications
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Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 1
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ESD Discharge
Steady−State Power per Resistor
Steady−State Power per Package
Operating Temperature Range
Storage Temperature Range
Junction Temperature
This device is a ten−line EMI filter array for wireless applications.
Filter Response
EMI Filtering and ESD Protection
Integration of 50 Discretes
Provides Protection for IEC61000−4−2 (Level 4)
Flip−Chip Package
Moisture Sensitivity Level 1
ESD Rating: Machine Model = C; Human Body Model = 3B
Pb−Free Package is Available*
Reduces EMI/RFI Emissions on a Data Line
Integrated Solution Offers Cost and Space Savings
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Integrated Solution Improves System Reliability
LCD for Cell Phones and PDAs
Computers and Printers
Communication Systems
MP3 Players
♦
IEC61000−4−2
8.0 kV (Contact)
Rating
(T
Contact Discharge
A
= 25°C unless otherwise noted)
Symbol
T
V
T
P
P
STG
T
OP
PP
R
T
J
−55 to +150
−40 to +85
Value
+125
100
200
8.0
1
Unit
mW
mW
kV
°C
°C
°C
†For information on tape and reel specifications,
NUF9002FCT1
NUF9002FCT1G
INPUT
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
E
D
C
B
A
Device
A1
(Note: Microdot may be in either location)
GND
IN6
IN1
O1
O6
1
ORDERING INFORMATION
NUF9002 = Specific Device Code
A
Y
WW
G
CASE 499G
PIN CONFIGURATION
Flip−Chip
http://onsemi.com
LOW−PASS FILTER
GND
IN7
IN2
O2
O7
2
C
R
input
= Pb−Free Package
(Ball Side)
(Pb−Free)
I/O
Flip−Chip
Flip−Chip
= Assembly Location
= Year
= Work Week
Package
= 100 W
GND
= 28 pF
IN8
IN3
O3
O8
3
Publication Order Number:
MARKING DIAGRAM
Ç Ç
Ç Ç
GND
IN9
IN4
O4
O9
NUF9002
4
AYWWG
3000 Tape & Reel
3000 Tape & Reel
G
Shipping
NUF9002FC/D
IN10
O10
GND
IN5
O5
5
OUTPUT
†