MAX13331GEE/V+T Maxim Integrated Products, MAX13331GEE/V+T Datasheet - Page 12
![IC AMP STEREO HEADPHONE 16-QSOP](/photos/6/61/66127/175-16-qsop_sml.jpg)
MAX13331GEE/V+T
Manufacturer Part Number
MAX13331GEE/V+T
Description
IC AMP STEREO HEADPHONE 16-QSOP
Manufacturer
Maxim Integrated Products
Series
DirectDrive™r
Type
Class ABr
Datasheet
1.MAX13330GEEV.pdf
(15 pages)
Specifications of MAX13331GEE/V+T
Output Type
Headphones, 2-Channel (Stereo)
Max Output Power X Channels @ Load
135mW x 2 @ 32 Ohm
Voltage - Supply
4 V ~ 5.5 V
Features
Depop, Short-Circuit Protection, Shutdown
Mounting Type
Surface Mount
Package / Case
16-QSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Automotive DirectDrive Headphone Amplifiers
with Output Protection and Diagnostics
The value of the flying capacitor (C1) affects the charge
pump’s load regulation and output resistance. A C1
value that is too small degrades the device’s ability to
provide sufficient current drive, which leads to a loss of
output voltage. Increasing the value of C1 improves
load regulation and reduces the charge-pump output
resistance to an extent. See the Output Power vs.
Load Resistance graph in the Typical Operating
Characteristics . Above 1µF, the on-resistance of the
switches and the ESR of C1 and C2 dominate.
The hold capacitor value and ESR directly affect the
ripple at CPVSS. Increasing the value of C2 reduces
output ripple. Likewise, decreasing the ESR of C2
reduces both ripple and output resistance. Lower
capacitance values can be used in systems with low
maximum output power levels. See the Output Power
vs. Load Resistance graph in the Typical Operating
Characteristics .
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Holding Capacitor (C2)
Flying Capacitor (C1)
The power-supply bypass capacitor (C3) lowers the
output impedance of the power supply and reduces the
impact of the MAX13330/MAX13331 charge-pump
switching transients. Bypass CPVDD with C3, the same
value as C1, and place it physically close to the CPVDD
and PGND pins.
Proper layout and grounding are essential for optimum
performance. Connect CPVDD and V
device. Connect CPVSS and V
device. Bypassing of both supplies is accomplished by
charge-pump capacitors C2 and C3 (see the Typical
Application Circuits ). Place capacitors C2 and C3 as
close to the device as possible and bypass them to the
PGND plane. Keep PGND and all traces that carry
switching transients as short as possible to minimize
EMI. Route them away from SGND, the audio signal
path, and the external feedback components
(MAX13331). Connect the PGND plane and the SGND
plane together at a single point on the PCB. Refer to
the MAX13330/MAX13331 Evaluation Kit for layout
guidelines.
Power-Supply Bypass Capacitor (C3)
Layout and Grounding
SS
DD
together at the
together at the