AN241 Philips Semiconductors, AN241 Datasheet

AN241

Manufacturer Part Number

AN241

Description

Manufacturer

Philips Semiconductors

Datasheet

1.AN241.pdf (11 pages)

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Philips Semiconductors Advanced BiCMOS Products

INTRODUCTION

Thermal characteristics of integrated circuit

packages have been and increasingly will be

a major consideration to both producers and

users of electronics products. This is

because an increase in junction temperature

operating life of an IC. The advantages

realized by miniaturization often have

trade–offs in terms of increased junction

temperatures. Some of the variables affecting

others are controlled by the system designer.

Depending on the environment in which the

IC is placed, the user could control well over

75% of the current that flows through the

device.

With the ever increasing use of Surface

Mount Device (SMD) technology,

and 50MHz; 50% duty cycle; C

100, and 200pF; also 1, 2, 4, and 8 outputs

switching.

The first current term is due to I

device unloaded. It is caused by the internal

switching of the device.

This term represents the I

absolutely no load. This measurement was

taken without the output pins connected to

the board. The C

by:

“s” is the number of outputs switching. C

be different for each product type.

June, 1992

Thermal considerations for advanced logic

families (Futurebus+, ABT and MULTIBYTE)

are controlled by the IC manufacturer and

) can adversely effect the long term

= 5V; 25 C; F

(@50MHz)

OUT

for a device is calculated

) (V

i 1

= 1, 10, 20, 30, 40,

(49MHz)s

OUT

i 1

) (V

current with

OUT i

Power Dissipation Equation

= 0, 15, 50,

(@1MHz)

with the

)

i 1

L I

will

)

i 1

OUT i

CCL

management of thermal characteristics

becomes a growing concern because not

only are the SMD packages much smaller,

but the thermal energy is concentrated more

densely on the printed wiring board. For

these reasons, designers and manufacturers

of surface mount assemblies must be aware

of all the variables affecting T

POWER DISSIPATION

Power dissipation for the ABT (Advanced

BiCMOS Technology), MULTIBYTE and

Futurebus+ devices can be estimated using

the same equation with the exception of

Futurebus+ transceivers. Due to BTL

OPEN–COLLECTOR outputs, BTL output

swings and the large current driven on the

BTL side (B side) of the transceivers the

equation must be altered.

The second term is current due to I

the outputs unloaded. This I

switching the bipolar outputs.

The I

found in the corresponding product data

sheets. In the case of a 50% duty cycle an

average of I

device. “n” is the number of outputs on the

device.

The third term is I

being held Low. The I

L I

i 1

OUT i

CCH

CCL

P i

and I

CCL

i 1

CCL

CCH

n L

www.DataSheet4U.com

and I

CCL

)

are the typical values

CCH

due to the outputs

CCH

will flow through the

current is in the A

) s

is caused by

with

There are five major factors controlled by the

user which contribute to increased BiCMOS

power dissipation.

Each of these five factors are addressed in

the estimating equation except duty cycle.

Duty cycle can be addressed by “weighting”

terms 2, 5, 6, 7 and 8 appropriately.

Conditions under which measurements were

taken and upon which the Power Dissipation

Equation is based are:

range so if an output is held or forced High

then there is no appreciable I

“L” is the number of outputs held Low.

The fourth term is through current due to

holding the CMOS inputs at 3.4V rather than

at the rail voltages. This term becomes

insignificant as load and frequency increase.

input High of a device to 3.4V. This value is

typically 300 A to 500 A. “n3” is the number

of inputs at 3.4V.

The fifth term is current through the upper

structure of the device. It is caused by the

external capacitive load and the output

1. Frequency of operation (output switching

2. Input voltage levels

3. Output loading (capacitive and resistive)

4. V

5. Duty cycle

frequency)

is the through current when holding the

level

CCL

Application note

AN241

increase.

Related parts for AN241

AN241 Summary of contents

Page 1

... CCL being held Low. The I current is in the A CCH 1 Application note AN241 There are five major factors controlled by the user which contribute to increased BiCMOS power dissipation. 1. Frequency of operation (output switching frequency) 2. Input voltage levels 3. Output loading (capacitive and resistive) 4 ...

Page 2

... C numbers. Over time C for all ABT and P P MULTIBYTE products will be characterized. Refer to the individual product data sheets for their values if the values are not noted below. 2 Application note AN241 74ABT125 6.0pF 74ABT126 6.5pF 74ABT240 7.0pF 74ABT240–1 7.0pF 74ABT244 4.5pF 74ABT244– ...

Page 3

... JA substrate upon which the IC is mounted, the layout density , the air–gap between the 3 Application note AN241 package and the substrate, the number and length of traces on the board, thermally conductive epoxies , and external cooling . PACKAGE CONSIDERATIONS Following is a brief discussion on various package factors and their effect on thermal resistance ...

Page 4

... Finding Application note AN241 When calculating the total power dissipation of the device, the first four terms are multiplied which in this example is CC 5V. 5V(17.625mA) = 88.1mW The fifth and sixth terms are multiplied by the ...

Page 5

... JA –30 –35 –40 – 100 120 0 100 Average Effect of Air Flow Application note AN241 3. Determine JA The FB2031 is packaged in the 52–pin PQFP. Using an average die size of 118 138 yields C power JA dissipation (see graph Determine @ 721.9mW Using the AVERAGE EFFECT of POWER DISSIPATION on ...

Page 6

... Data SOL– www.DataSheet4U.com DIE SIZE (SQ MILS 1000) Still Air Philips PCB (1.12” 0.75” 0.059”) 15% Still Air Philips PCB (1.58” 0.75” 0.059”) 15% 6 Application note AN241 2 Typical Data SOL–20 JA 100 DIE SIZE (SQ MILS 1000) ...

Page 7

... DIE SIZE (SQ MILS 1000) June, 1992 ) in C/W JA Typical Data DIP– 0.75W DIE SIZE (SQ MILS 1000) NOTE Test Ambiant Still Air Test Fixture Textool ZIF Socket .040” Stand–Off) www.DataSheet4U.com Accuracy 15 Application note AN241 Typical Data DIP– 1. DIE SIZE (SQ MILS 1000) 40 ...

Page 8

... Data PLCC– 1. 100 DIE SIZE (SQ MILS 1000) Typical Data PQFP–100 1. www.DataSheet4U.com DIE SIZE (SQ MILS 1000) Still Air Signetics PCB (2.24” 2.24” 0.062”) 15% AND CALCULATIONS Application note AN241 Typical Data PLCC– 1. 100 DIE SIZE (SQ MILS 1000) ...

Page 9

... Change in Power Dissipation Average Effect of Power Dissipation C/W JC Typical Data SO–16 www.DataSheet4U.com 0. DIE SIZE (SQ MILS 1000) Typical Data SOL– 0. DIE SIZE (SQ MILS 1000) 9 Application note AN241 120 JC Typical Data SOL– 0. DIE SIZE (SQ MILS 1000) NOTE: Test Fixture Infinite Heat Sink Accuracy 15 ...

Page 10

... JC Typical Data DIP– 0.75W DIE SIZE (SQ MILS 1000) Typical Data PLCC– 0.75W 35 D www.DataSheet4U.com DIE SIZE (SQ MILS 1000) NOTE: Test Fixture Accuracy 10 Application note AN241 Typical Data DIP– 1. DIE SIZE (SQ MILS 1000) Typical Data PLCC– 1. 100 DIE SIZE (SQ MILS ...

Page 11

... The use of thermally conductive adhesive under SO packages can lower thermal resistance by providing a direct heat flow path from the package to board. Naturally 11 Application note AN241 NOTES: Test Fixture Infinite Heat Sink Accuracy 15% Data for the 20/24–pin SSOP is preliminary. Graphs are not yet available. Please see the table, ” ...

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