LM4875MX/NOPB National Semiconductor, LM4875MX/NOPB Datasheet - Page 10

• Manufacturer Part Number: LM4875MX/NOPB
• Description: IC AMP AUDIO PWR 1W MONO 8SOIC
• Manufacturer: National Semiconductor
• Series: Boomer®r
• Type: Class ABr

Specifications of LM4875MX/NOPB

• Output Type: 1-Channel (Mono) with Mono Headphones
• Max Output Power X Channels @ Load: 1W x 1 @ 8 Ohm; 110mW x 1 @ 32 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Depop, Mute, Shutdown, Thermal Protection, Volume Control
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Operational Class: Class-AB
• Audio Amplifier Function: Headphone/Speaker
• Total Harmonic Distortion: 0.6@8Ohm@300mW%
• Single Supply Voltage (typ): 3/5V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 50dB
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC N
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: LM4875MX

www.national.com
Application Information
an external 1kΩ - 5kΩ resistor can be placed in parallel with
the internal 20kΩ resistor. The tradeoff for using this resistor
is increased quiescent current.
RECOMMENDED PRINTED CIRCUIT BOARD LAYOUT
Figure 4 through Figure 6 show the recommended two-layer
PC board layout that is optimized for the SO-8 packaged
LM4875 and associated external components. Figure 7
through Figure 9 show the recommended two-layer PC
board layout for the MSOP packaged LM4875. Both layouts
are designed for use with an external 5V supply, 8Ω speak-
ers, and 8Ω - 32Ω headphones. The schematic for both
recommended PC board layouts is Figure 1.
Both circuit boards are easy to use. Apply a 5V supply
voltage and ground to the board’s V
respectively. Connect a speaker with an 8Ω minimum imped-
ance between the board’s -OUT and +OUT pads. For head-
phone use, the layout has provisions for a headphone jack,
J1. When a jack is connected as shown, inserting a head-
phone plug automatically switches off the external speaker.
FIGURE 4. Recommended SO PC board layout:
component side silkscreen
DD
(Continued)
and GND pads,
10104238
10
FIGURE 5. Recommended SO PC board layout:
FIGURE 6. Recommended SO PC board layout:
component side layout
bottom side layout
10104239
10104240