LMV1015UR-15/NOPB National Semiconductor, LMV1015UR-15/NOPB Datasheet - Page 10

• Manufacturer Part Number: LMV1015UR-15/NOPB
• Description: IC AMP AUDIO MONO AB MIC 4USMD
• Manufacturer: National Semiconductor
• Type: Class ABr

Specifications of LMV1015UR-15/NOPB

• Output Type: 1-Channel (Mono)
• Voltage - Supply: 2 V ~ 5 V
• Features: Microphone
• Mounting Type: Surface Mount
• Package / Case: 4-MicroSMD
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 1-Channel Mono
• Audio Amplifier Function: Microphone
• Total Harmonic Distortion: 0.13@2200Ohm%
• Single Supply Voltage (typ): 3V
• Dual Supply Voltage (typ): Not RequiredV
• Supply Current (max): 0.3@5VmA
• Power Supply Requirement: Single
• Rail/rail I/o Type: No
• Single Supply Voltage (min): 2V
• Single Supply Voltage (max): 5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 4
• Package Type: uSMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Max Output Power X Channels @ Load: -
• Lead Free Status / Rohs Status: Compliant
• Other names: LMV1015UR-15; LMV1015UR-15TR

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Physical Dimensions
NOTE: UNLESS OTHERWISE SPECIFIED.
1. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB
PAGE (www.national.com).
2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
3. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
4. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
5. REFERENCE JEDEC REGISTRATION MO-211. VARIATION CA.
NOTE: UNLESS OTHERWISE SPECIFIED.
1. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB
PAGE (www.national.com).
2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
3. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
4. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
5. NO JEDEC REGISTRATION AS OF March 2005.
4-Bump Extreme Thin micro SMD with Large Dome Bump Technology
4-Bump ULTRA-Thin micro SMD with Large Dome Bump Technology
inches (millimeters) unless otherwise noted
X
X
1
1
= 0.975 mm X
= 0.975 mm X
NS Package Number XRA04ADA
NS Package Number URA04ADA
2
2
= 1.051 mm X
= 1.051 mm X
10
3
3
= 0.300 mm
= 0.400 mm