LMV1032UP-25/NOPB National Semiconductor, LMV1032UP-25/NOPB Datasheet - Page 11

• Manufacturer Part Number: LMV1032UP-25/NOPB
• Description: IC AMP AUDIO MONO AB MIC 4USMD
• Manufacturer: National Semiconductor
• Type: Class ABr

Specifications of LMV1032UP-25/NOPB

• Output Type: 1-Channel (Mono)
• Voltage - Supply: 1.7 V ~ 5 V
• Features: Microphone
• Mounting Type: Surface Mount
• Package / Case: 4-MicroSMD
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 1-Channel Mono
• Audio Amplifier Function: Microphone
• Total Harmonic Distortion: 0.35%
• Single Supply Voltage (typ): 3V
• Dual Supply Voltage (typ): Not RequiredV
• Supply Current (max): 0.085@5VmA
• Power Supply Requirement: Single
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 65dB
• Single Supply Voltage (min): 1.7V
• Single Supply Voltage (max): 5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 4
• Package Type: uSMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Max Output Power X Channels @ Load: -
• Lead Free Status / Rohs Status: Compliant
• Other names: LMV1032UP-25; LMV1032UP-25TR

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
BANNED SUBSTANCE COMPLIANCE
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
Leadfree products are RoHS compliant.
Physical Dimensions
NOTE: UNLESS OTHERWISE SPECIFIED.
1. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB
PAGE (www.national.com).
2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
3. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
4. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
5. REFERENCE JEDEC REGISTRATION MO-211. VARIATION CA.
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
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X1 = 1.133
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inches (millimeters) unless otherwise noted (Continued)
±
0.03 mm X2 = 1.133
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NS Package Number UPA04QQA
4-Bump Ultra Thin micro SMD
±
0.03 mm X3 = 0.35
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
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±
0.045 mm
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