LM4864M/NOPB National Semiconductor, LM4864M/NOPB Datasheet - Page 14

• Manufacturer Part Number: LM4864M/NOPB
• Description: IC AMP AUDIO PWR .725W AB 8SOIC
• Manufacturer: National Semiconductor
• Series: Boomer®r
• Type: Class ABr

Specifications of LM4864M/NOPB

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 725mW x 1 @ 8 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Shutdown, Thermal Protection
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Amplifier Class: AB
• No. Of Channels: 1
• Output Power: 675mW
• Supply Voltage Range: 2.7V To 5.5V
• Load Impedance: 8ohm
• Operating Temperature Range: -40°C To +85°C
• Amplifier Case Style: SOIC
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: *LM4864M; *LM4864M/NOPB; LM4864M

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LM4864 MDC MWC
725MW Audio Power Amplifier With Shutdown Mode
SIGNAL NAME
BYPASS
GND
INPUT +
GND
NC
INPUT -
VOUT 1
VDD
GND
NC
NC
VOUT 2
SHUTDOWN
Physical Die Identification
Die Step
Wafer Diameter
Dise Size (Drawn)
Thickness
Min Pitch
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
PAD# NUMBER
Fabrication Attributes
Physical Attributes
10
11
12
13
(Referenced to die center, coordinates in µm) NC = No Connection
1
2
3
4
5
6
7
8
9
Die Bond Pad Coordinate Locations (B - Step)
DIE/WAFER CHARACTERISTICS
-322
-359
-359
-359
-323
-109
-109
LM4862B
B
150mm
1283µm x 952µm
51mils x 37mils
406µm Nominal
117µm Nominal
358
358
359
323
X
8
8
X/Y COORDINATES
Die Layout (B - Step)
14
-259
-523
-523
-523
523
259
141
406
523
523
523
-78
Y
5
01260740
Bond Pad Opening Size (min)
Bond Pad Metalization
Passivation
Back Side Metal
Back Side Connection
General Die Information
86
86
86
86
86
86
86
86
86
86
86
86
86
X
PAD SIZE
x
x
x
x
x
x
x
x
x
x
x
x
x
86µm x 86µm
ALUMINUM
NITRIDE
Bare Back
GND
188
188
188
188
86
86
86
86
86
86
86
86
86
Y