LM4819MX National Semiconductor, LM4819MX Datasheet - Page 4

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LM4819MX

Manufacturer Part Number
LM4819MX
Description
IC AMP AUDIO PWR .35W MONO 8SOIC
Manufacturer
National Semiconductor
Series
Boomer®r
Type
Class ABr
Datasheets

Specifications of LM4819MX

Output Type
1-Channel (Mono)
Max Output Power X Channels @ Load
350mW x 1 @ 16 Ohm
Voltage - Supply
2 V ~ 5.5 V
Features
Depop, Differential Inputs, Shutdown
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
LM4819MXTR

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Electrical Characteristics V
The following specifications apply for V
25˚C. (Continued)
Note 1: See AN-450 ’Surface Mounting and their Effects on Product Reliability’ for other methods of soldering surface mount devices.
Note 2: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 3: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given. However, the typical value is a good indication of device’s performance.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
allowable power dissipation is P
mounted is 210˚C/W for the MSOP package and 170˚C/W for the SOP package.
Note 5: Human body model, 100pF discharged through a 1.5 k
Note 6: Machine Model, 220pF–240pF capacitor is discharged through all pins.
Note 7: Typical specifications are specified at 25˚C and represent the parametric norm.
Note 8: Tested limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 9: Datasheet min/max specification limits are guaranteed by designs, test, or statistical analysis.
Note 10: The given
that of the Exposed-DAP itself. The Exposed-DAP of the LDA08B package should be electrically connected to GND or an electrically isolated copper area.
Note 11: The given
Note 12: The shutdown pin (pin1) should be driven as close as possible to V
External Components Description
Typical Performance Characteristics
THD+N vs Frequency
Components
1.
2.
3.
4.
5.
C
C
R
R
C
S
B
i
i
f
JA
JA
Combined with R
C
This input coupling capacitor blocks DC voltage at the amplifier’s terminals. Combined with R
high pass filter with R
for an explanation of how to determine the value of C
Combined with R
This is the power supply bypass capacitor that filters the voltage applied to the power supply pin. Refer to
the Application Information section for proper placement and selection of C
This is the bypass pin capacitor that filters the voltage at the BYPASS pin. Refer to the section, Proper
Selection of External Components, for information concerning proper placement and selection of C
is for an LM4819 package in an LDA08B with the Exposed-DAP soldered to a printed circuit board copper pad with an area equivalent to
is for an LM4819 package in an LDA08B with the Exposed-DAP not soldered to any printed circuit board copper.
i
at f
DMAX
c
= 1/(2 R
= (T
JMAX
i
C
f
i
, this is the feedback resistor that sets the closed-loop gain: A
–T
, this inverting input resistor sets the closed-loop gain. R
i
).
DD
A
)/
i
at f
JA
= 3V and R
DS200136-37
. For the LM4819, T
DD
c
= 1/(2 R
= 3V
resistor.
L
= 16
i
C
i
( Figure 1 )
). Refer to the section, Proper Selection of External Components
(Notes 2, 3)
JMAX
DD
Functional Description
THD+N vs Frequency
load unless otherwise stated. Limits apply to T
4
= 150˚C and the typical junction-to-ambient thermal resistance (
for minimum current in Shutdown Mode.
i
.
JMAX
,
JA
, and the ambient temperature T
i
also forms a high pass filter with
s
.
v
= 2(R
DS200136-38
F
/R
A
i
).
=
i
, it creates a
A
. The maximum
JA
) when board
B
.

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