54326-1 TE Connectivity, 54326-1 Datasheet - Page 2

• Manufacturer Part Number: 54326-1
• Description: Power to the Board CONTACT POSTED GOLD
• Manufacturer: TE Connectivity
• Series: Series Ir

Specifications of 54326-1

• Product Type: Contacts
• Contact Gender: Pin (Male)
• Termination Style: Solder
• Contact Plating: Gold (30)
• Contact Material: Copper
• Termination Method To Wire/cable: Solder
• Termination Method To Pc Board: Through Hole - Solder
• Pcb Mounting Orientation: Vertical
• Ul File Number: E28476
• Csa File Number: LR7189
• Make First / Break Last: No
• Contact - Rated Current (a): 31
• Operating Voltage Reference: AC
• Operating Voltage (vac): 600
• Tail Length (mm [in]): 33.02 [1.3]
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 0.90 [0.035]
• Length (x-axis) (mm [in]): 50.80 [1.9999]
• Width (z-axis) (mm [in]): 3.76 [0.148]
• Underplate Material Thickness (µm [?in]): 1.27 [50.000]
• Contact Type: Pin/Socket
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.762 [30]
• Contact Base Material: Copper
• Tail Plating Material: Gold
• Tail Plating, Thickness (µm [?in]): 0.762 [30]
• Contact Design: Spring Latch
• Underplate Material: Nickel
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Vde Tested: No
• Agency/standard: UL, CSA
• Ul Rating: Recognized
• Csa Certified: Yes
• Operating Temperature (°c [°f]): -40 – +75 [-40 – +167]
• Applies To: Printed Circuit Board
• Application Use: Wire-to-Board
• Contact Transmits (typical Application): Power
• Packaging Method: Loose Piece
• Lead Free Status / Rohs Status: Details

3.4.
3.5.
Rev B
Exam ination of product.
Term ination resistance.
Insulation resistance.
Dielectric withstanding voltage.
Tem perature rise vs current.
Solderability.
Crim p tensile.
Vibration, sinusoidal.
Perform ance and Test Description
Product is designed to m eet electrical, m echanical and environm ental perform ance requirem ents
specified in Figure 1. Unless otherwise specified, all tests shall be perform ed at am bient environm ental
conditions per Test Specification 109-1.
Test Requirem ents and Procedures Sum m ary
Test Description
Meets requirem ents of product
drawing.
2.5 m illiohm s m axim um .
1000 m egohm s m inim um .
1500 vac at sea level.
30 C m axim um tem perature rise at
specified current of 31 am peres ac.
Solderable area shall have
m inim um of 95% solder coverage.
No discontinuities of 1
m icrosecond or longer duration.
See Note.
W ire Size
( AW G)
18
16
14
12
Figure 1 (continued)
MECHANICAL
ELECTRICAL
Requirem ent
(Lbs m axim um )
Crim p Tensile
20
30
50
50
TE 109-6-7.
TE Spec 109-28-4.
TE Spec 109-29-1.
Visual, dim ensional and functional
per applicable quality inspection
plan and Certificate of
Conform ance.
Subject m ated contacts assem bled
in housing to 50 m v m axim um open
circuit at 1 am pere m axim um .
See Figure 3.
Test between adjacent contacts of
m ated sam ples ganged together.
Test between adjacent contacts of
m ated sam ples ganged together
and a m etal plate.
See Figure 4.
TE Spec 109-45-1 and 109-151.
Measure tem perature rise vs
current.
See Figures 5 and 6.
TE Spec 109-11-2.
Subject contacts to solderability.
TE Spec 109-16.
Determ ine crim p tensile at
m axim um rate of 1 inch per m inute.
TE Spec 109-21-1.
Subject m ated sam ples to 10-55-10
Hz traversed in 1 m inute at .06 inch
total excursion. 1.3 hours in each of
3 m utually perpendicular planes.
See Figure 7.
Procedure
108-11026
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