PKGS-00MF-R Murata Electronics North America, PKGS-00MF-R Datasheet - Page 419

• Manufacturer Part Number: PKGS-00MF-R
• Description: SENSOR SHOCK
• Manufacturer: Murata Electronics North America

Specifications of PKGS-00MF-R

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

GA2
GA3
GCJ
GCM
GCM
GJM
GMA
GMD
GNM
GQM
GR4
GR7
GRJ
420
GRM
GRM
GRM
GRM
IM
IRS
LDA
LDB
LDC
LDD
LDM
LFB_BA
LFB_BB
LFB_BF
LFB_CB
LFB_CC
LFB_CG
LFB_SG
LFB_SP
LFD
LFL
LLA
LLL
LLM
LLR
LQG
LQH
LQH
LQH
LQH
LQM
LQM
LQM
LQP
LQW
LQW
LQW
LQW
MA
MEV
MHM
MHR
MKFCC
MM
MP
MPD
MV
Part Number
!Note
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product
• You are able to read a detailed specifications in the website (http://search.murata.co.jp/) before to require our product specifications or to transact the approval sheet for product specifications.
Please check with our sales representatives or product engineers before ordering.
before ordering. Especially, please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in them to prevent smoking and/or burning, etc.
specifications before ordering.
Part Numbers Alphabetic Index
Chip Monolithic Ceramic Capacitors AC250V(r.m.s.) Type ...................................................................................... 29, 100
Chip Monolithic Ceramic Capacitors Safety Standard Certified ....................................................................... 29, 101–103
Chip Monolithic Ceramic Capacitors for Medium Voltage: Automotive Soft Termination Type .................................. 29, 98
Chip Monolithic Ceramic Capacitors for Automotive ............................................................................................ 29, 85–89
Chip Monolithic Ceramic Capacitors for Medium Voltage: Automotive .............................................................. 29, 99–100
Chip Monolithic Ceramic Capacitors Low Dissipation Type ................................................................................. 29, 68–75
Chip Monolithic Ceramic Capacitors Monolithic Microchip ........................................................................................ 29, 82
Chip Monolithic Ceramic Capacitors for Bonding ................................................................................................. 29, 83–84
Chip Monolithic Ceramic Capacitors Capacitor Array ......................................................................................... 29, 60–63
Chip Monolithic Ceramic Capacitors High Frequency .......................................................................................... 29, 76–81
Chip Monolithic Ceramic Capacitors for Medium Voltage : Information Devices ................................................. 29, 96–97
Chip Monolithic Ceramic Capacitors for Medium Voltage : Only for Camera Flash Circuit ........................................ 29, 97
Chip Monolithic Ceramic Capacitors for Medium Voltage : Soft Termination Type .............................................. 29, 90–91
Chip Monolithic Ceramic Capacitors for Medium Voltage : Low Dissipation ........................................................ 29, 91–94
Chip Monolithic Ceramic Capacitors for Medium Voltage : High Capacitance ..................................................... 29, 94–95
Chip Monolithic Ceramic Capacitors for Medium Voltage : Only for LCD Back Lighting Inverters Circuit .................. 29, 96
Chip Monolithic Ceramic Capacitors Standard Type .................................................................................................. 29–60
Fresnel Lens ........................................................................................................................................................... 370–371
Pyroelectric Infrared Sensor ........................................................................................................................................... 370
Chip Multilayer Antennas ........................................................................................................................................ 352–353
Chip Multilayer Hybrid Baluns ................................................................................................................................ 351–352
Chip Multilayer Hybrid Couplers ............................................................................................................................. 346–348
Chip Multilayer Hybrid Dividers .............................................................................................................................. 348–349
Chip Multilayer Hybrid Baluns ........................................................................................................................................ 352
Chip Multilayer LC Filters (Balanced Filters) .................................................................................................................. 320
Chip Multilayer LC Filters (Balanced Filters) .................................................................................................................. 320
Chip Multilayer LC Filters (Balanced Filters) .................................................................................................................. 320
Chip Multilayer LC Filters (BPF) ..................................................................................................................................... 312
Chip Multilayer LC Filters (BPF) ..................................................................................................................................... 314
Chip Multilayer LC Filters (BPF) ............................................................................................................................. 313–314
Chip Multilayer LC Filters (BPF) ............................................................................................................................. 312–317
Chip Multilayer LC Filters (BPF) ..................................................................................................................................... 317
Chip Multilayar Diplexers ........................................................................................................................................ 349–350
Chip Multilayer LC Filters Low Pass Filter for RF/Local ......................................................................................... 317–319
Chip Monolithic Ceramic Capacitors Eight Terminals Low ESL ........................................................................... 29, 66–67
Chip Monolithic Ceramic Capacitors Reversed Geometry Low ESL .................................................................... 29, 63–65
Chip Monolithic Ceramic Capacitors Ten Terminals Low ESL ............................................................................. 29, 67–68
Chip Monolithic Ceramic Capacitors Controlled ESR Low ESL ........................................................................... 29, 63, 65
Chip Inductor (Chip Coil) for High Frequency Multilayer Type ....................................................................... 223, 236–239
Chip Inductor (Chip Coil) Power Inductor (Wire Wound Type for Choke) ...................................................... 223, 267–271
Chip Inductor (Chip Coil) for General Use Wire Wound Type ........................................................................ 223, 249–253
Chip Inductor (Chip Coil) Power Inductor (Wire Wound Type) ....................................................................... 223, 255–262
Chip Inductor (Chip Coil) for High Frequency Vertical Wire Wound Ferrite Type .......................................... 223, 235–236
Chip Inductor (Chip Coil) Power Inductor (Multilayer Type for Choke) ........................................................... 223, 271–272
Chip Inductor (Chip Coil) Power Inductor (Multilayer Type) ........................................................................... 223, 262–266
Chip Inductor (Chip Coil) for General Use Multilayer Type ............................................................................ 223, 253–255
Chip Inductor (Chip Coil) for High Frequency Film Type ................................................................................ 223, 239–249
Chip Inductor (Chip Coil) for High Frequency Vertical Wire Wound ............................................................... 223, 233–234
Chip Inductor (Chip Coil) for High Frequency Horizontal Wire Wound ................................................................... 223–232
Chip Inductor (Chip Coil) for High Frequency Horizontal Wire Wound Ferrite Type .............................................. 223, 235
Chip Inductor (Chip Coil) Power Inductor (Wire Wound Type for Choke) ...................................................... 223, 266–267
Ultrasonic Sensors ................................................................................................................................................. 372–374
Angular Rate Sensors .................................................................................................................................................... 375
Ionizer Modules (Ionissimot) ........................................................................................................................................ 406
High Voltage Resistors ................................................................................................................................................... 275
Ceramic Filters (BGS Filters) for IF ................................................................................................................................ 340
Receptacle Used on Coaxial Connectors .............................................................................................................. 358–360
Power Supplies ....................................................................................................................................................... 400–401
DC-DC Converters ................................................................................................................................................. 402–405
Platform of Highly Efficient Power Supplies ................................................................................................................... 401
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K99E.pdf
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