NA-5W-K Fujitsu Components, NA-5W-K Datasheet - Page 8
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NA-5W-K
Manufacturer Part Number
NA-5W-K
Description
Manufacturer
Fujitsu Components
Type
Miniature Relayr
Datasheet
1.NA-5W-K.pdf
(9 pages)
Specifications of NA-5W-K
Relay Construction
Non-Latching
Contact Arrangement
DPDT
Coil Voltage Dc
5V
Coil Current
28.09mA
Contact Form
2 Form C
Voltage Rating (vdc)
220V
Voltage Rating (vac)
250V
Dropout Volt (min)
0.5VDCV
Coil Resistance
178Ohm
Pick-up Voltage (max)
3.75VDC
Maximum Power Rating
30W/62.5VA
Operate Time
6ms
Contact Current Rating
2A
Contact Material
Au/Ag
Coil Suppression Diode
No
Push To Test Button
No
Led Indicator
No
Seal
Sealed
Product Height (mm)
9.7mm
Product Depth (mm)
7.4mm
Product Length (mm)
14.9mm
Operating Temp Range
-40C to 85C
Pin Count
8
Mounting Style
Through Hole
Termination Style
Solder Pin
Package / Case
DIP
Lead Free Status / Rohs Status
Compliant
RoHS Compliance and Lead Free Information
1. General Information
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2. Recommended Lead Free Solder Profile
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3. Moisture Sensitivity
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4. Tin Whiskers
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Flow Solder condition:
Pre-heating:
Soldering:
Solder by Soldering Iron:
Soldering Iron
Temperature:
Duration:
Recommended solder Sn-3.0Ag-0.5Cu.
We highly recommend that you confirm your actual solder conditions
(Amendment to Directive 2002/95/EC)
This material has been verified to be compatible with PbSn assembly process.
Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.
Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable length
whisker was found by our in house test.
All signal and power relays produced by Fujitsu Components are compliant with RoHS directive 2002/95EC
Cadmium as used in electrical contacts is exempted from the RoHS directives on October 21st, 2005.
All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info for older date codes
at: http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf
Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified.
including amendments.
maximum 120˚C
dip within 5 sec. at
260˚C solder bath
maximum 360˚C
maximum 3 sec.
FTR-K1 SERIES
NA SERIES
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