FT232RQ R FTDI, Future Technology Devices International Ltd, FT232RQ R Datasheet - Page 38

• Manufacturer Part Number: FT232RQ R
• Description: IC USB TO SERIAL UART 32-QFN
• Manufacturer: FTDI, Future Technology Devices International Ltd
• Series: USBmadeEZ-UARTr

Specifications of FT232RQ R

• Features: USB to UART
• Number Of Channels: 1, UART
• Fifo's: 256 Byte
• Protocol: RS-232, RS-422, RS-485
• Voltage - Supply: 3.3 V ~ 5.25 V
• With Auto Flow Control: Yes
• With Modem Control: Yes
• With Cmos: Yes
• Mounting Type: Surface Mount
• Package / Case: 32-QFN
• For Use With: 768-1023 - MOD USB RS232 DEV/EVAL FT232RL768-1022 - MODULE USB - SERIAL MODULE MINI768-1021 - MODULE MINI DEVELOPMENT FT232RQ768-1019 - MODULE USB-SER UART FT232 24-DIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 768-1008-2; FT232RQ R

9.5 Solder Reflow Profile
The FT232R is supplied in Pb free 28 LD SSOP and QFN-32 packages. The recommended solder reflow
profile for both package options is shown in Figure 9.5.
Figure 9.5 FT232R Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both
a completely Pb free solder process (i.e. the FT232R is used with Pb free solder), and for a non-Pb free
solder process (i.e. the FT232R is used with non-Pb free solder).
Table 9.1 Reflow Profile Parameter Values
Time Maintained Above Critical Temperature
Time within 5°C of actual Peak Temperature
25
Time for T= 25°C to Peak Temperature, T
T
T
p
L
T Max
T Min
S
S
Average Ramp Up Rate (T
- Temperature Max (T
- Temperature Min (T
- Time (t
Peak Temperature (T
- Temperature (T
Profile Feature
Ramp Down Rate
- Time (t
Preheat
s
Copyright © 2010 Future Technology Devices International Limited
Min to t
(t
T = 25º C to T
T
Preheat
Time, t (seconds)
L
p
:
)
t
S
L
)
s
Max)
s
s
L
)
Min.)
Max.)
P
s
p
)
to T
Ramp Up
p
)
p
Pb Free Solder Process
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
8 minutes Max.
t
p
FT232R USB UART IC Datasheet Version 2.07
150°C
200°C
217°C
260°C
t
L
Ramp
Down
Critical Zone: when
T is in the range
T to T
L
Document No.: FT_000053
Non-Pb Free Solder Process
Clearance No.: FTDI# 38
p
3°C / Second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
6 minutes Max.
100°C
150°C
183°C
240°C
38