C3225X5R0J336M/2.00 TDK Corporation, C3225X5R0J336M/2.00 Datasheet - Page 69

• Manufacturer Part Number: C3225X5R0J336M/2.00
• Description: CAP CER 33UF 6.3V 20% X5R 1210
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C3225X5R0J336M/2.00

• Capacitance: 33µF
• Voltage - Rated: 6.3V
• Tolerance: ±20%
• Temperature Coefficient: X5R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 85°C
• Applications: General Purpose
• Ratings: -
• Package / Case: 1210 (3225 Metric)
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (max): -
• Thickness (max): 0.087" (2.20mm)
• Lead Spacing: -
• Features: -
• Lead Style: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 445-7737-2

TDK MLCC US Catalog
Material: Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness: Appendix-2a
General
Specifications
Applied for C0603, C1005, C1608, C2012, C3216
c
Solder resist
Solder Resist
100 mm
Copper (thickness 0.035mm)
Solder resist
P.C. Board for reliability test
P.C. Board for bending test
Applied for C0603, C1005
Appendix - 1a
Appendix - 2a
Appendix-1a, 1b, 2b
b
100 mm
Copper
b
0.8mm
a
1.6mm
Copper
c
Page 71
C Series – General Application
C0603
C1005
C1608
C2012
C3216
C3225
C4532
C5750
Applied for C1608, C2012, C3216, C3225, C4532, C5750
JIS
Case Code
c
Solder Resist
100 mm
CC0201
CC0402
CC0603
CC0805
CC1206
CC1210
CC1812
CC2220
Applied for C3225, C4532, C5750
EIA
P.C. Board for reliability test
P.C. Board for bending test
Slit
Appendix - 1b
Appendix - 2b
b
100 mm
0.3
0.4
1.0
1.2
2.2
2.2
3.5
4.5
Solder Resist
a
a
Dimensions (mm)
Copper
0.8
1.5
3.0
4.0
5.0
5.0
7.0
8.0
b
Copper
Version B11
1.65
0.3
0.5
1.2
2.0
2.9
3.7
5.6
c