C3225X5R0J226K/2.50 TDK Corporation, C3225X5R0J226K/2.50 Datasheet - Page 70
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C3225X5R0J226K/2.50
Manufacturer Part Number
C3225X5R0J226K/2.50
Description
CAP CER 22UF 6.3V 10% X5R 1210
Manufacturer
TDK Corporation
Series
Cr
Datasheets
1.C1005X7R1E103K.pdf
(1 pages)
2.C0603C0G1E120J.pdf
(31 pages)
3.C2012X5R1A225M0.85.pdf
(72 pages)
Specifications of C3225X5R0J226K/2.50
Capacitance
22µF
Voltage - Rated
6.3V
Tolerance
±10%
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Applications
General Purpose
Ratings
-
Package / Case
1210 (3225 Metric)
Size / Dimension
0.126" L x 0.098" W (3.20mm x 2.50mm)
Height - Seated (max)
-
Thickness (max)
0.110" (2.80mm)
Lead Spacing
-
Features
-
Lead Style
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-7735-2
Wave Soldering
Symbol
Reflow Soldering
Symbol
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
TDK MLCC US Catalog
A
B
C
A
B
C
A
B
C
Type
Type
Type
Soldering
Information
C
B
0.25 - 0.35
0.25 - 0.35
[CC0603]
[CC0201]
[CC1206]
0.7 - 1.0
0.8 - 1.0
0.6 - 0.8
0.2 - 0.3
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
C1608
C0603
C3216
Chip capacitor
A
0.35 - 0.45
[CC0805]
[CC0402]
[CC1210]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
0.3 - 0.5
0.4 - 0.6
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
C2012
C1005
C3225
Solder land
[CC1206]
[CC0603]
[CC1812]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Unit: mm
C3216
C1608
C4532
Maximum amount
Minimum amount
Solder resist
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
[CC0805]
[CC2220]
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
C2012
C5750
Unit: mm
Unit: mm
Page 72
Peak
Temp
C Series – General Application
• Recommended Soldering Profile
0
Solder
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free
Soldering
Over 60 sec.
soldering
soldering
soldering
Preheating
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Manual
Reflow
Solder
Solder
Sn-Pb
Wave
Wave Soldering
△T
Temp./
Dura.
Peak Temp time
Soldering
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
300
Peak temp
0
250 max.
260 max.
(°C)
Over 60 sec.
Wave Soldering
Natural
cooling
Case Size - JIS (EIA)
∆T
Manual soldering
Preheating
(Solder iron)
Duration
3 max.
5 max.
3sec. (As short as possible)
(sec.)
Peak
Temp
0
Over 60 sec.
∆T
Preheating
Peak temp
230 max.
260 max.
Reflow Soldering
(°C)
Reflow Soldering
Peak Temp time
Soldering Natural
Version B11
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
Duration
20 max.
10 max.
(sec.)
cooling