SI3066-B-FS Silicon Laboratories Inc, SI3066-B-FS Datasheet - Page 15

• Manufacturer Part Number: SI3066-B-FS
• Description: IC DAA ENH FCC LINE-SIDE 8SOIC
• Manufacturer: Silicon Laboratories Inc
• Type: Single Chipr

Specifications of SI3066-B-FS

• Package / Case: *
• Function: Direct Access Arrangement (DAA)
• Number Of Circuits: 1
• Current - Supply: 9mA
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Includes: Billing Tone Detection, Line Voltage Monitor, Loop Current Monitor, Overload Detection, Ring Detector
• Product: Modem Chip
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Power (watts): -
• Interface: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

4.11. Ringer Impedance and Threshold
The ring detector in many DAAs is ac-coupled to the
line with a large 1 µF, 250 V decoupling capacitor. The
ring detector on the Si3066 is resistively coupled to the
line. The network presents a high ringer impedance to
the line of approximately 5 MΩ to meet the majority of
PTT
impedance network shown in Figure 9 is required for
compliance with the ringer impedance requirements of
South Korea. This network is only required if the
application will be deployed in South Korea. The
network components are detailed in Table 8.
4.12. DTMF Dialing
The Si3066 meets all the country requirements for
DTMF dialing listed in Table 5 on page 10. Higher
DTMF levels can be achieved if the amplitude is
increased and the peaks of the DTMF signal are clipped
at digital full scale, avoiding wrapping the waveform.
Clipping
intermodulation of the signal. Generally, increased
distortion between 10 and 20% is acceptable during
Figure 9. South Korea Ringer Impedance
Table 8. South Korea Ringer Impedance
specifications,
Item
C15
R14
Z2
Z3
the
RING
Network Components
signal
TIP
Network
including
produces
7.5 kΩ, 1/4 W
1 mF, 250 V
Value
R14
Z3
FCC.
Z2
18 V
18 V
C15
distortion
The
ringer
and
Rev. 1.0
DTMF signaling. DTMF levels several dB higher can be
achieved with this technique, compared with a digital
full-scale peak signal.
4.13. Pulse Dialing
Going off- and on-hook to generate make and break
pulses accomplishes pulse dialing. The nominal rate is
10 pulses per second.
4.14. Receive Overload
Certain line events, such as an off-hook event on a
parallel phone, a billing tone, or a polarity reversal, can
cause a receiver overload. Although the DAA may
remain off-hook during such an event, the data received
from the line may be corrupted.
If a disturbance on the line causes the loop current to
collapse below the minimum operating current, the
dropout detect bit, DOD, is set. An interrupt will be
generated if the dropout detect interrupt mask bit,
DODM, is set.
4.15. On-Hook Line Monitor Mode
The DAA monitors line activity when in on-hook line-
monitor mode. This mode detects caller ID data, and no
line current is drawn. See Section “4.16. Caller ID” on
page 15. This mode is enabled by setting the ONHM bit
(Register 5, bit 3). ARX [2:0] (Register 15, bits 2:0)
provides gain to the normal receive path of the DAA and
functions as a gain bit for the on-hook line monitor.
4.16. Caller ID
The DAA can pass caller ID data from the phone line to
a software caller ID decoder.
4.16.1. Type I Caller ID
Type I Caller ID sends the CID data while the phone is
on-hook. In systems where the caller ID data is passed
on the phone line between the first and second rings,
utilize the following method to capture the caller ID data:
1. After identifying a ring signal using one of the
2. Assert the ONHM bit (Register 5, bit 3) to enable the
3. Clear the ONHM bit after the caller ID data is
methods described in Section "4.9. Ring Detection"
on page 14, determine when the first ring has
completed.
caller ID ADC. This low-current ADC, which is
powered from the system-side device, digitizes the
caller ID data.
received.
Si3066
15