SI3200-GS Silicon Laboratories Inc, SI3200-GS Datasheet - Page 106
![IC LINEFEED INTRFC 100V 16SOIC](/photos/6/80/68073/16-soic__3_9mmwidth__sml.jpg)
SI3200-GS
Manufacturer Part Number
SI3200-GS
Description
IC LINEFEED INTRFC 100V 16SOIC
Manufacturer
Silicon Laboratories Inc
Series
ProSLIC®r
Specifications of SI3200-GS
Function
Subscriber Line Interface Concept (SLIC), CODEC
Interface
GCI, PCM, SPI
Number Of Circuits
2
Voltage - Supply
3.3V, 5V
Current - Supply
110µA
Power (watts)
941mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (3.9mm Width)
Includes
Battery Switching, BORSCHT Functions, DTMF Generation and Decoding, FSK Tone Generation, Modem and Fax Tone Detection
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI3200-GS
Manufacturer:
SILICON
Quantity:
1
Part Number:
SI3200-GS
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
Company:
Part Number:
SI3200-GSR
Manufacturer:
SILICON
Quantity:
12 000
Si3220/25 Si3200/02
106
Pin #(s)
epad
12
13
14
15
16
Symbol
IRINGN
IRINGP
THERM
ITIPN
ITIPP
GND
Output
Input/
O
I
I
I
I
Description
Negative RING Current Control.
Connect to the IRINGN lead of the Si3220 or Si3225.
Positive RING Current Drive.
Connect to the IRINGP lead of the Si3220 or Si3225.
Thermal Sensor.
Connect to THERM pin of Si3220 or Si3225.
Negative TIP Current Control.
Connect to the ITIPN lead of the Si3220 or Si3225.
Positive TIP Current Control.
Connect to the ITIPP lead of the Si3220 or Si3225.
Exposed Die Paddle Ground.
For adequate thermal management, the exposed die paddle should be sol-
dered to a PCB pad that is connected to low-impedance inner and/or back-
side ground planes using multiple vias. See “7. Package Outline: 16-Pin
ESOIC” for PCB pad dimensions.
Rev. 1.3