STM32F417IGT6 STMicroelectronics, STM32F417IGT6 Datasheet - Page 87
![Microcontrollers (MCU) ARM M4 1024 FLASH 168 Mhz 192kB SRAM](/photos/39/71/397107/lqfp-144_sml.jpg)
STM32F417IGT6
Manufacturer Part Number
STM32F417IGT6
Description
Microcontrollers (MCU) ARM M4 1024 FLASH 168 Mhz 192kB SRAM
Manufacturer
STMicroelectronics
Datasheet
1.STM32F417ZGT6.pdf
(168 pages)
Specifications of STM32F417IGT6
Core
ARM Cortex M4
Processor Series
STM32F4
Data Bus Width
32 bit
Maximum Clock Frequency
168 MHz
Program Memory Size
1024 KB
Data Ram Size
192 KB
On-chip Adc
Yes
Number Of Programmable I/os
140
Number Of Timers
10
Operating Supply Voltage
1.7 V to 3.6 V
Package / Case
LQFP-176
Mounting Style
SMD/SMT
A/d Bit Size
12 bit
A/d Channels Available
24
Interface Type
CAN, I2C, I2S, SPI, UART
Program Memory Type
Flash
Lead Free Status / Rohs Status
Details
Available stocks
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Manufacturer
Quantity
Price
Company:
Part Number:
STM32F417IGT6
Manufacturer:
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Quantity:
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STM32F415xx, STM32F417xx
Table 28.
1. Resonator characteristics given by the crystal/ceramic resonator manufacturer.
2. Based on characterization, not tested in production.
3. The relatively low value of the RF resistor offers a good protection against issues resulting from use in a
4. t
For C
5 pF to 25 pF range (typ.), designed for high-frequency applications, and selected to match
the requirements of the crystal or resonator (see
same size. The crystal manufacturer typically specifies a load capacitance which is the
series combination of C
can be used as a rough estimate of the combined pin and board capacitance) when sizing
C
microcontrollers” available from the ST website www.st.com.
Figure 29. Typical application with an 8 MHz crystal
1. R
Low-speed external clock generated from a crystal/ceramic resonator
The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic
resonator oscillator. All the information given in this paragraph are based on characterization
results obtained with typical external components specified in
the resonator and the load capacitors have to be placed as close as possible to the oscillator
pins in order to minimize output distortion and startup stabilization time. Refer to the crystal
resonator manufacturer for more details on the resonator characteristics (frequency,
package, accuracy).
t
SU(HSE
Symbol
L1
f
OSC_IN
humid environment, due to the induced leakage and the bias condition change. However, it is
recommended to take this point into account if the MCU is used in tough humidity conditions.
oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly
with the crystal manufacturer
SU(HSE)
R
g
and C
C
EXT
i
2
m
F
L1
Resonator with
integrated capacitors
(4)
value depends on the crystal characteristics.
and C
is the startup time measured from the moment it is enabled (by software) to a stabilized 8 MHz
L2
Oscillator frequency
Feedback resistor
Recommended load capacitance
versus equivalent serial
resistance of the crystal (R
HSE driving current
Oscillator transconductance
Startup time
. Refer to the application note AN2867 “Oscillator design guide for ST
HSE 4-26 MHz oscillator characteristics
L2
, it is recommended to use high-quality external ceramic capacitors in the
C L2
C L1
Parameter
L1
and C
8 MH z
resonator
R
EXT
Doc ID 022063 Rev 2
(1)
L2
. PCB and MCU pin capacitance must be included (10 pF
S
)
(3)
OSC_OU T
OSC_IN
V
DD
V
R F
with 30 pF load
= 3.3 V, V
DD
Conditions
R
Figure
Startup
S
is stabilized
controlled
= 30 Ω
Bias
gain
(1) (2)
IN
29). C
= V
SS
Table
L1
STM32F
Electrical characteristics
and C
Min
4
5
-
-
-
-
29. In the application,
f HSE
L2
Typ
200
15
2
are usually the
-
-
-
Max
26
1
-
-
-
-
ai17530
mA/V
87/168
MHz
Unit
mA
ms
kΩ
pF
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