T520L337M2R5ATE009 Kemet, T520L337M2R5ATE009 Datasheet - Page 58

• Manufacturer Part Number: T520L337M2R5ATE009
• Description: CAP TANT 330UF 2.5V 20% 2312
• Manufacturer: Kemet
• Series: KO Cap T520r
• Type: Moldedr

Specifications of T520L337M2R5ATE009

• Capacitance: 330µF
• Voltage - Rated: 2.5V
• Tolerance: ±20%
• Esr (equivalent Series Resistance): 9.0 mOhm
• Operating Temperature: -55°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 2312 (6032 Metric)
• Size / Dimension: 0.236" L x 0.126" W (6.00mm x 3.20mm)
• Height - Seated (max): 0.075" (1.90mm)
• Lead Spacing: -
• Manufacturer Size Code: L
• Features: Polymer
• Lifetime @ Temp.: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 399-5607-2

Tantalum Surface Mount Capacitors – Low ESR
Tantalum Stack MnO
Storage
Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature - reels may soften or warp, and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC, and maximum storage humidity not exceed
60% relative humidity. In addition, temperature fl uctuations should be minimized to avoid condensation on the parts, and atmospheres
should be free of chlorine and sulphur bearing compounds. For optimized solderability, chip stock should be used promptly, preferably
within three years of receipt.
Packaging
• Tantalum Stacks Packaging EIA-451 Packaging Material Standards for ESD Sensitive Items
• Antistatic Plastic Trays
• Polyurethane Polyether Foam
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
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Surface Mount Capacitors – TSM Series MnO
2
TC102_LOWESR • 9/8/2011
T2021_TSM • 9/8/2011
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