MCP1754ST-5002E/MB Microchip Technology, MCP1754ST-5002E/MB Datasheet - Page 16
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MCP1754ST-5002E/MB
Manufacturer Part Number
MCP1754ST-5002E/MB
Description
IC REG LDO 150MA 5.0V SOT89-3
Manufacturer
Microchip Technology
Series
-r
Datasheet
1.MCP1754ST-5002EMB.pdf
(42 pages)
Specifications of MCP1754ST-5002E/MB
Regulator Topology
Positive Fixed
Voltage - Output
5V
Voltage - Input
Up to 16V
Voltage - Dropout (typical)
0.3V @ 150mA
Number Of Regulators
1
Current - Output
150mA (Min)
Current - Limit (min)
-
Operating Temperature
-40°C ~ 125°C
Mounting Type
*
Package / Case
*
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP1754ST-5002E/MB
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP1754/MCP1754S
3.4
The SHDN input is used to turn the LDO output voltage
on and off. When the SHDN input is at a logic-high
level, the LDO output voltage is enabled. When the
SHDN input is pulled to a logic-low level, the LDO
output voltage is disabled. When the SHDN input is
pulled low, the PWRGD output also goes low and the
LDO enters a low quiescent current shutdown state.
3.5
For fixed applications, the PWRGD output is an open-
drain output used to indicate when the LDO output
voltage is within 92% (typically) of its nominal
regulation value. The PWRGD threshold has a typical
hysteresis value of 2%. The PWRGD output is delayed
by 100 µs (typical) from the time the LDO output is
within 92% + 2% (typical hysteresis) of the regulated
output value on power-up. This delay time is internally
fixed. The PWRGD pin may be pulled up to V
V
device is in shutdown (/SHDN = 0V) mode.
DS22276A-page 16
OUT
. Pulling up to V
Shutdown Input (SHDN)
Power Good Output (PWRGD)
OUT
conserves power when the
IN
or
3.6
Some of the packages have an exposed metal pad on
the bottom of the package. The exposed metal pad
gives the device better thermal characteristics by
providing a good thermal path to either the PCB or heat
sink to remove heat from the device. The exposed pad
of the package is internally connected to GND.
Exposed Pad (EP)
© 2011 Microchip Technology Inc.