STM32F407VGT6 STMicroelectronics, STM32F407VGT6 Datasheet - Page 143

IC MCU 32BIT 1MB FLASH 100LQFP

STM32F407VGT6

Manufacturer Part Number
STM32F407VGT6
Description
IC MCU 32BIT 1MB FLASH 100LQFP
Manufacturer
STMicroelectronics
Datasheets

Specifications of STM32F407VGT6

Core Processor
ARM Cortex-M4
Core Size
32-Bit
Speed
168MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
82
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
192K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 16x12b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Core
ARM Cortex M4
Processor Series
STM32F4
Data Bus Width
32 bit
Maximum Clock Frequency
168 MHz
Data Ram Size
192 KB
On-chip Adc
Yes
Number Of Programmable I/os
82
Number Of Timers
10
Operating Supply Voltage
1.7 V to 3.6 V
Mounting Style
SMD/SMT
A/d Bit Size
12 bit
A/d Channels Available
16
Interface Type
CAN, I2C, I2S, SPI, UART
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-11605

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STM32F405xx, STM32F407xx
6.2
Thermal characteristics
The maximum chip-junction temperature, T
using the following equation:
Where:
P
taking into account the actual V
application.
Table 88.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
I/O
Symbol
Θ
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
JA
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in °C/W,
max = Σ (V
max is the product of I
Thermal resistance junction-ambient
LQFP 64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP 144 - 20 × 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFBGA176 - 10× 10 mm / 0.5 mm pitch
Package thermal characteristics
OL
× I
OL
INT
T
) + Σ((V
Parameter
J
Doc ID 022152 Rev 1
max = T
OL
max and P
DD
/ I
and V
DD
OL
– V
A
and V
max + (P
DD
OH
I/O
J
, expressed in Watts. This is the maximum chip
max, in degrees Celsius, may be calculated
OH
) × I
max (P
/ I
OH
D
OH
),
max x Θ
D
of the I/Os at low and high level in the
max = P
JA
)
INT
Value
Package characteristics
45
40
39
max + P
I/O
max),
°C/W
Unit
143/154

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