PIC18F4585-H/PT Microchip Technology, PIC18F4585-H/PT Datasheet - Page 458

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PIC18F4585-H/PT

Manufacturer Part Number
PIC18F4585-H/PT
Description
IC MCU 8BIT 48KB FLASH 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheet

Specifications of PIC18F4585-H/PT

Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
36
Program Memory Size
48KB (24K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 150°C
Package / Case
44-TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC18F2585/2680/4585/4680
DS39625C-page 456
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
b
D
Dimension Limits
e
Preliminary
Units
A2
E1
A2
A1
E1
L1
N
A
E
D
α
e
h
L
φ
c
b
β
α
E
MIN
2.05
0.10
0.25
0.40
0.18
0.31
φ
L1
L
MILLMETERS
10.30 BSC
17.90 BSC
1.27 BSC
7.50 BSC
1.40 REF
h
NOM
28
Microchip Technology Drawing C04-052B
h
© 2007 Microchip Technology Inc.
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
β
c

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