ISL23348UFVZ Intersil, ISL23348UFVZ Datasheet - Page 18

• Manufacturer Part Number: ISL23348UFVZ
• Description: IC DGTL POT 4CH 50K 20TSSOP
• Manufacturer: Intersil
• Series: XDCP™r

Specifications of ISL23348UFVZ

• Taps: 128
• Resistance (ohms): 50K
• Number Of Circuits: 4
• Temperature Coefficient: 65 ppm/°C Typical
• Memory Type: Volatile
• Interface: I²C (Device Address)
• Voltage - Supply: 1.2 V ~ 5.5 V, 1.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: *
• Package / Case: *
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Package Outline Drawing
M20.173
20 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 5/10
6.40
0.20 C B A
4.40 ±0.10
2
SEATING
PLANE
(0.65 TYP)
(5.65)
C
0.10 C
3
TYPICAL RECOMMENDED LAND PATTERN
H
20
1
18
6.50 ±0.10
SIDE VIEW
TOP VIEW
1
0.65
- 0.05
0.10
3
0.25 +0.05/-0.06 5
M
C B A
(0.35 TYP)
10
9
A
I.D. MARK
ISL23348
PIN #1
(1.45)
B
1.20 MAX
NOTES:
1.
2.
3.
4.
5.
6.
7.
Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
Dimensions are measured at datum plane H.
Dimensioning and tolerancing per ASME Y14.5M-1994.
Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
is 0.07mm.
Dimension in ( ) are for reference only.
Conforms to JEDEC MO-153.
0.90 +0.15/-0.10
0.15 MAX
0.05 MIN
SEE DETAIL "X"
0.09-0.20
DETAIL "X"
END VIEW
1.00 REF
GAUGE
PLANE
August 24, 2011
0.60 ±0.15
0°-8°
FN7903.1
0.25