LE75183BFSCT Zarlink, LE75183BFSCT Datasheet
LE75183BFSCT
Specifications of LE75183BFSCT
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LE75183BFSCT Summary of contents
Page 1
... EMRs. The Le75183A/B/C/D devices are pin-for-pin compatible with Zarlink’s L7583A/B/C/D devices. Zarlink also offers a range of compatible SLIC devices and codec/filters that can be used with the VE750 series LCAS for complete line card solutions that can be used worldwide in analog line card applications. ...
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... Switching Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Loss of Battery Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Impulse Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Protection .15 Integrated SLIC Device Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Physical Dimensions .22 28-Pin, Plastic SOIC (GULL) (Le75183AESC/BESC/CESC/CZESC/DESC .22 20-Pin, Plastic SOIC (GULL) (Le75183ASC/BSC/CSC/DSC .23 32-Pin QFN (Le75183QC/BEQC/CQC/DQC .24 Revision history .25 Revision .25 Revision .25 Revision .25 2 Zarlink Semiconductor Inc. ...
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... The Le75183 device is packaged in a 20-pin, plastic SOIC (GULL) (Le75183ASC/BSC/CSC/DSC), a 32-pin QFN (Le75183AQC/ BQC/CQC/DQC), and a 28-pin, plastic SOIC (GULL) (Le75183AESC/BESC/CESC/CZESC/DESC). The 28-pin package is available to support existing designs. For new designs, it may be advantageous to use the other two packages for smaller in size. 3 Zarlink Semiconductor Inc. ...
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... DGND Figure 2. Le75183B/D Le75183B/D FGND SW1 TBAT SW3 SW4 TLINE SW5 SW7 SW9 SW10 VDD Control Logic TSD DGND 4 Zarlink Semiconductor Inc. VBAT SW2 RTESTin RBAT RLINE SW6 RRINGING RTESTout LATCH INTESTin INRING INTESTout VBAT SW2 RTESTin RBAT RLINE SW6 RRINGING ...
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... NC 3 TLINE 4 32-pin QFN EXPOSED PAD FGND 20 VBAT RTESTin 19 RBAT 18 RLINE 17 TTESTin RRINGING 16 RTESTout TBAT 15 LATCH 14 TLINE INTESTin 13 TRINGING INRING 12 INTESTout 11 TTESTout DGND 5 Zarlink Semiconductor Inc RBAT 23 NC RLINE RRINGING 19 NC RTESTout VBAT RTESTin 5 24 RBAT 6 23 RLINE 7 22 28-Pin SOIC ...
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... HIGH (not recommended) Battery voltage. Used as a reference for protection circuit supply. Exposed pad in QFN package. No internal electrical connection. Not recommended to make any external electrical connection (such as VBAT or ground) to the EPAD. 6 Zarlink Semiconductor Inc. Ω typical pull up. Ω typical pull down. Ω ...
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... Refer to IPC/JEDEC J-Std-020B Table 5-2 for the recommended solder reflow temperature profile. Environmental Ranges Zarlink guarantees the performance of this device over commercial (0 to 70º C) and industrial (-40 to 85ºC) temperature ranges by conducting electrical characterization over each range and by conducting a production test with single insertion coupled to periodic sampling ...
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... Min. — 0.760 1.1 — — 0.850 2.1 — — 0.860 1.3 — Test Condition (on) = ±5 mA, ±10 mA (on) = ±5 mA, ±10 mA (on) = ±5 mA, ± Zarlink Semiconductor Inc. Figure 8, on page 19 µ LCAS Device Power mW BAT Typ Max Min. Typ 4 10 — 3 — ...
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... Sensitivity *This parameter is not tested in production. Choice of secondary protector should ensure this rating is not exceeded. †Applied voltage is 100 Vp-p square wave at 100 Hz. Not tested in production. Test Condition @ 50 Hz/60 Hz LIMIT 9 Zarlink Semiconductor Inc. Measure Min Typ Max I — — 1 ...
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... Vswitch (both poles) = ±330 V, Logic inputs = Gnd –40 °C Vswitch (both poles) = ±310 V, Logic inputs = Gnd dV/dt Sensitivity* — *Applied voltage is 100 Vp-p square wave at 100 Hz. Not tested in production. Test Condition Measure 10 Zarlink Semiconductor Inc. Min Typ Max Unit I — — 1 ...
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... Sensitivity *This parameter is not tested in production. Choice of secondary protector should ensure this rating is not exceeded. †Applied voltage is 100 Vp-p square wave at 100 Hz. Not tested in production. Test Condition @ 50 Hz/60 Hz LIMIT 11 Zarlink Semiconductor Inc. Measure Min Typ Max Unit I — — ...
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... Sensitivity *This parameter is not tested in production. Choice of secondary protector should ensure this rating is not exceeded. †Applied voltage is 100 Vp-p square wave at 100 Hz. Not tested in production. Test Condition = 0 Test Condition @ 50 Hz/60 Hz LIMIT 12 Zarlink Semiconductor Inc. Measure Min Typ Max I — — 1 ...
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... V, DD BAT Vlogicin = 5 – BAT Vlogicin = 5 – BAT Vlogicin = 5 – BAT Vlogicin = 0 V — — 13 Zarlink Semiconductor Inc. Measure Min Typ Max Unit — — — 0.8 V — 2.2 — — V llogicin — — 500 llogicin — — 500 llogicin — ...
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... Hold this state for ≤ All Off 25 ms. SW8 waiting for zero current to turn off. Zero current has occurred All Off and SW8 has opened. Idle/Talk Release break switches. 14 Zarlink Semiconductor Inc. Break Ring Ring All Other Switches Return Access Access 3 & 4 Switch 7 ...
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... Note that the current-limit circuitry has a negative temperature coefficient. Thus, if the device is subjected to an extended power cross, the value of current seen at TBAT/RBAT will decrease as the device heats due to the fault current. If sufficient heating occurs, the temperature shutdown mechanism will activate and the device will enter an all off mode. 15 Zarlink Semiconductor Inc. ...
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... Series current-limiting fused resistors or PTC resistors should be chosen so as not to exceed the current rating of the external secondary protector. Refer to the manufacturer’s data sheet for specifications. | breakdownmin(break < V breakovermax breakdownmin(ring breakovermin 16 Zarlink Semiconductor Inc. | ...
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... Trigger current — V — BAT 0 0.5 µ 2 0.5 µs — Figure 3. Protection Circuits V – 3 BAT Zarlink Semiconductor Inc. Min Typ Max — — 3.5 — 5 — — — ‡ — — –0.5 — 70 — — ...
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... Figure 4. Switches and LIMIT –1.5 V 1.5 V – 2 LIMIT CURRENT LIMITING –I Figure 5. Switch LIM1 2/3 R –V –V –V –1.5 R MAX 1.5 –I LIM2 –I LIM1 Figure 6. Switches 1, 2, and 5 +I –1.5 V 1.5 V – 2 –I 18 Zarlink Semiconductor Inc. CURRENT LIMITING 2 LIM2 MAX 2 ...
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... APPLICATION Figure 8. Typical LCAS Application, A/C Versions, Idle or Talk State Shown R1 TIP Crowbar Protection RING R2 *Contact a Zarlink Sales/Application representative for recommendations. Figure 7. Switches –V OS – –I Ringing Test Return SW5 SW9 SW7 SW1 Test Out Ringing Test In Return SW3 Break SW4 Break ...
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... Off 1/Float 1 Off Off 1/Float 1 Off Off 1Float 2 Off Off 0 is floating, the thermal shutdown mechanism is active not affected by the LATCH input Zarlink Semiconductor Inc. Ring Test Ring TESTout Switches Switches Switches 3 Off Off Off 4 Off Off On 5 Off Off Off ...
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... Off 1/Float 1 Off Off 1/Float 1 Off Off 1/Float 2 Off Off 0 is floating, the thermal shutdown mechanism is active not affected by the LATCH input Zarlink Semiconductor Inc. Ring Test Ring TESTout Switches Switches Switches 3 Off Off Off 4 Off Off On 5 Off Off Off ...
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... NOTE: Option: Square dotted line is E-Pad outline Size dependent on die attach pad 28-Pin SOIC 22 Zarlink Semiconductor Inc. Inch Min Nom Max 0.092 0.100 0.104 0.004 0.006 0.012 0.013 0.016 0.020 0.009 0.010 ...
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... NOTE: Option: Square dotted line is E-Pad outline Size dependent on die attach pad 20-Pin SOIC 23 Zarlink Semiconductor Inc. Inch Min Nom Max 0.092 0.100 0.104 0.004 0.006 0.012 0.013 0.016 0.020 0.009 0.010 ...
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... The Terminal #1 identifier may be either a mold or marked feature. 5.90 5. Coplanarity applies to the exposed pad as well as the terminals. 6. Reference Document: JEDEC MO-220. 0.63 7. Lead width deviates from the JEDEC MO-220 standard. 0.05 32-Pin QFN 24 Zarlink Semiconductor Inc degrees. ...
Page 25
... Ordering Information, on page • Added notes to table in Ordering Information, on page • Added Package Assembly, on page 7 Revision • Enhanced format of package drawings in • Added new headers/footers due to Zarlink purchase of Legerity on August 3, 2007 1; removed non-green OPNs. 1. Physical Dimensions, on page 22 25 Zarlink Semiconductor Inc. ...
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... Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned ...