IBM25PPC750FL-GR0133T IBM MICROELECTRONICS, IBM25PPC750FL-GR0133T Datasheet - Page 30

• Manufacturer Part Number: IBM25PPC750FL-GR0133T
• Description: MPU 750xx RISC 32-Bit 0.13um 600MHz 1.8V/2.5V/3.3V 750-Pin CBGA Tray
• Manufacturer: IBM MICROELECTRONICS

Specifications of IBM25PPC750FL-GR0133T

• Package: 750CBGA
• Device Core: PowerPC
• Family Name: 750xx
• Number Of Cpu Cores: 1
• Data Bus Width: 32 Bit
• Maximum Speed: 600 MHz
• I/o Voltage: 1.8|2.5|3.3 V
• Operating Temperature: -40 to 105 °C

PowerPC 750FL RISC Microprocessor
Figure 4-2. Mechanical Dimensions and Bottom Surface Nomenclature of the Reduced Lead CBGA Package
Dimensions and Signal Assignments
Page 30 of 65
A01
Corner
Not To Scale
(19X)
A1
A
1
Y
W
(19X)
V
U
1
T
R
P
292X
N
M
0.25
0.1
B
L
2
K
C
C
J
(bottom side view)
A
H
B
G
F
E
B1
D
C
B
A
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A01 Corner
A2
Note: All caps on the SCM are lower in height than the processor die.
D
C
Notes:
1. Dimensioning and tolerancing per
2. Dimensions in millimeters.
DIM
A1
A2
B1
G1
H1
H2
F1
A
B
C
D
G
H
F
1
2
ASME Y14.5M, 1994.
F1
G1
G
Minimum
2.302
1.902
0.822
1.56
1.08
0.40
(7x) (0.51 Max)
1.5 Maximum
2.5 Maximum
Millimeters
0.7 ± 0.1
21 ± 0.2
21 ± 0.2
7.122
5.412
1.5
1.0
Maximum
2.828
2.228
0.908
1.90
1.32
0.60
750flds60.fm.6.0
Preliminary
April 27, 2007
F
H1
H2
H