LE77D112BTC Zarlink, LE77D112BTC Datasheet - Page 12

• Manufacturer Part Number: LE77D112BTC
• Description: SLIC 1-CH 63dB 3.3V 44-Pin eTQFP Tray
• Manufacturer: Zarlink

Specifications of LE77D112BTC

• Package: 44eTQFP
• Number Of Channels Per Chip: 1
• Polarity Reversal: Yes
• Longitudinal Balanced: 63 dB
• Minimum Operating Supply Voltage: 3.135 V
• Typical Operating Supply Voltage: 3.3 V

ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under
these limits is not implied. Exposure to absolute maximum ratings for extended periods can affect device reliability.
Notes:
Thermal limiting circuitry on chip will shut down the circuit at a junction temperature of about 165ºC. Continuous operation above 145ºC junction
temperature may degrade device reliability.
The thermal performance of a thermally enhanced package is assured through optimized printed circuit board layout. Specified performance re-
quires that the exposed thermal pad be soldered to an equally sized exposed copper surface, which, in turn, conducts heat through 16 0.3 mm
diameter vias on a 1.27 mm pitch to a large (> 500 mm
Le77D112 and Le9502 Devices, document ID# 081013).
Package Assembly
The green package devices are assembled with enhanced environmental compatible lead (Pb), halogen, and antimony-free
materials. The leads possess a matte-tin plating which is compatible with conventional board assembly processes or newer lead-
free board assembly processes. The peak soldering temperature should not exceed 245°C during printed circuit board assembly.
The standard (non-green) package devices are assembled with industry-standard mold compounds, and the leads possess a tin/
lead (Sn/Pb) plating. These packages are compatible with conventional SnPb eutectic solder board assembly processes. The
peak soldering temperature should not exceed 225°C during printed circuit board assembly.
Refer to IPC/JEDEC J-Std-020B Table 5-2 for the recommended solder reflow temperature profile.
OPERATING RANGES
Zarlink guarantees the performance of this device over commercial (0° to 70°C) and industrial (−40° to 85°C)
temperature ranges by conducting electrical characterization over each range, and by conducting a production test
with single insertion coupled to periodic sampling. These characterization and test procedures comply with
4.6.2 of Bellcore GR-357-CORE
Environmental Ranges
Electrical Ranges
Storage temperature
Ambient temperature, under bias
V
V
BGND with respect to AGND
A (Tip) or B (Ring) to BGND:
Current from A (Tip) or B (Ring)
C1, C2, C3 to AGND
CHCLK
V
V
Maximum power dissipation,
T
Thermal Data:
Thermal Data:
ESD Immunity (Human Body Model)
Ambient Temperature
A
Component Reliability Assurance Requirements for Telecommunications Equipment
CC
REG
SW
REF
Absolute Maximum Ratings
Continuous
10 ms (F = 0.1 Hz)
1 µs (F = 0.1 Hz)
250 ns (F = 0.1 Hz)
= 85° C (See notes)
In 44-pin eTQFP package
In 44-pin eTQFP package
with respect to AGND
with respect to BGND
V
V
V
V
REG
REF
SW
CC
2
) internal copper plane. (Refer to Zarlink application note Layout Considerations for the
Zarlink Semiconductor Inc.
12
can cause permanent device failure. Functionality at or above
–55 to +150°C
-40° to 85°C
–0.4 to +6.5 V
+0.4 to –115 V
–100 to 100 mV
V
V
V
V
±150 mA
–0.4 to VCC + 0.4 V
AGND to VCC
BGND to +44 V
AGND to VCC
1.8 W
θ
32° C/W
θ
9.2° C/W
JESD22 Class 1C compliant
JA
JC
REG
REG
REG
REG
–1 to BGND +1
–5 to BGND +5
–10 to BGND +10
–15 to BGND +15
3.3 V ± 5%
8 to 40 V
1.40 V ± 50 mV
–7 to –110 V (0 V in Disconnect state)
-40° to 85°C
section
.