CY7C421-15VI Cypress Semiconductor Corp, CY7C421-15VI Datasheet - Page 18

• Manufacturer Part Number: CY7C421-15VI
• Description: FIFO Mem Async Dual Depth/Width Uni-Dir 512 x 9 28-Pin SOJ
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C421-15VI

• Package: 28SOJ
• Configuration: Dual
• Bus Directional: Uni-Directional
• Density: 4.5 Kb
• Organization: 512x9
• Data Bus Width: 9 Bit
• Timing Type: Asynchronous
• Expansion Type: Depth|Width
• Typical Operating Supply Voltage: 5 V
• Operating Temperature: -40 to 85 °C

Document #: 38-06001 Rev. *B
Ordering Information
Speed
(ns)
20
25
30
40
65
CY7C433–20AC
CY7C433–20AXC
CY7C433–20JC
CY7C433–20JXC
CY7C433–20PC
CY7C433–25JC
CY7C433–25PC
CY7C433–25VC
CY7C433–25JI
CY7C433–30JC
CY7C433–30PC
CY7C433–30JI
CY7C433–30PI
CY7C433–30DMB
CY7C433–30LMB
CY7C433–40JC
CY7C433–40PC
CY7C433–40VC
CY7C433–40JI
CY7C433–65JC
CY7C433–65PC
Ordering Code
(continued)
Package
Name
D22
A32
A32
P21
P21
V21
P21
P21
P21
V21
P21
J65
J65
J65
J65
J65
J65
L55
J65
J65
J65
32-Pin Thin Plastic Quad Flatpack
32-Pin Pb-Free Thin Plastic Quad Flatpack
32-Lead Plastic Leaded Chip Carrier
32-Lead Pb-Free Plastic Leaded Chip Carrier
28-Lead (300-Mil) Molded DIP
32-Lead Plastic Leaded Chip Carrier
28-Lead (300-Mil) Molded DIP
28-Lead (300-Mil) Molded SOJ
32-Lead Plastic Leaded Chip Carrier
32-Lead Plastic Leaded Chip Carrier
28-Lead (300-Mil) Molded DIP
32-Lead Plastic Leaded Chip Carrier
28-Lead (300-Mil) Molded DIP
28-Lead (300-Mil) CerDIP
32-Pin Rectangular Leadless Chip Carrier
32-Lead Plastic Leaded Chip Carrier
28-Lead (300-Mil) Molded DIP
28-Lead (300-Mil) Molded SOJ
32-Lead Plastic Leaded Chip Carrier
32-Lead Plastic Leaded Chip Carrier
28-Lead (300-Mil) Molded DIP
Package Type
CY7C419/21/25/29/33
Commercial
Commercial
Industrial
Commercial
Industrial
Military
Commercial
Industrial
Commercial
Page 18 of 25
Operating
Range
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