DSPD56367AG150 Freescale Semiconductor, DSPD56367AG150 Datasheet - Page 26

no-image

DSPD56367AG150

Manufacturer Part Number
DSPD56367AG150
Description
DSP Fixed-Point 24-Bit 150MHz 150MIPS 144-Pin LQFP Tray
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of DSPD56367AG150

Package
144LQFP
Numeric And Arithmetic Format
Fixed-Point
Maximum Speed
150 MHz
Ram Size
69 KB
Device Million Instructions Per Second
150 MIPS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPD56367AG150
Manufacturer:
FREESCALE/PB-FREE
Quantity:
126
Thermal Characteristics
3.3
3-2
1
2
3
Supply Voltage
All “3.3V tolerant” input voltages
Current drain per pin excluding V
Operating temperature range
Storage temperature
GND = 0 V, VCCP, VCCQL = 1.8 V ±5%, TJ = –40×C to +95×C, CL = 50 pF
All other VCC = 3.3 V ± 5%, TJ = –40×C to +95×C, CL = 50 pF
Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond
the maximum rating may affect device reliability or cause permanent damage to the device.
Temperatures below -0°C are qualified for consumer applications.
1
2
3
4
Natural Convection, Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Natural Convection, Thermal characterization parameter
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
Thermal Characteristics
Rating
Characteristic
3
1
CC
and GND
3
Table 3-2 Thermal Characteristics
DSP56367 Technical Data, Rev. 2.1
Table 3-1 Maximum Ratings
V
V
CCQH,
CCC,
4
V
CCQL,
Symbol
1,2
V
T
V
V
CCH,
T
STG
CCA,
I
IN
J
V
CCP
V
V
R
R
CCS,
CCD,
Symbol
θJC
θJA
Ψ
or θ
or θ
JT
JA
JC
GND
TQFP Value
0.3 to + 2.0
0.3 to + 4.0
Value
55 to +125
40 to + 95
0.3 to V
45.0
10.0
3.0
10
1, 2
CC
Freescale Semiconductor
+ 0.7
°
°
°
Unit
C/W
C/W
C/W
Unit
mA
°
°
V
V
V
C
C

Related parts for DSPD56367AG150