74LVC04APW NXP Semiconductors, 74LVC04APW Datasheet

Inverters 3.3V HEX INV

74LVC04APW

Manufacturer Part Number
74LVC04APW
Description
Inverters 3.3V HEX INV
Manufacturer
NXP Semiconductors
Datasheet

Specifications of 74LVC04APW

Number Of Circuits
6
Logic Family
LVC
Logic Type
CMOS
High Level Output Current
- 24 mA
Low Level Output Current
24 mA
Supply Voltage (max)
3.6 V
Supply Voltage (min)
1.2 V
Maximum Operating Temperature
+ 125 C
Package / Case
SOT-402
Mounting Style
SMD/SMT
Operating Supply Voltage
1.8 V, 2.5 V, 3.3 V
Lead Free Status / Rohs Status
 Details
Other names
74LVC04APW,112

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74LVC04APW
Manufacturer:
PULS
Quantity:
34
Part Number:
74LVC04APW
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
74LVC04APW
Quantity:
1 605
1. General description
2. Features and benefits
3. Ordering information
Table 1.
Type number
74LVC04AD
74LVC04ADB
74LVC04APW
74LVC04ABQ
Ordering information
Package
Temperature range Name
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
The 74LVC04A provides six inverting buffers. Inputs can be driven from either 3.3 V or 5 V
devices. This feature allows the use of these devices as translators in mixed 3.3 V
and 5 V applications.
74LVC04A
Hex inverter
Rev. 7 — 1 February 2011
5 V tolerant inputs for interfacing with 5 V logic
Wide supply voltage range from 1.2 V to 3.6 V
CMOS low power consumption
Direct interface with TTL levels
Inputs accept voltages up to 5.5 V
Complies with JEDEC standard no. 8-1A
ESD protection:
Specified from −40 °C to +85 °C and −40 °C to +125 °C
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
SO14
SSOP14
TSSOP14
DHVQFN14 plastic dual in-line compatible thermal enhanced very
Description
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
plastic thin shrink outline package; 14 leads;
body width 4.4 mm
thin quad flat package; no leads; 14 terminals;
body 2.5 × 3 × 0.85 mm
Product data sheet
Version
SOT108-1
SOT337-1
SOT402-1
SOT762-1

Related parts for 74LVC04APW

74LVC04APW Summary of contents

Page 1

... Type number Package Temperature range Name −40 °C to +125 °C 74LVC04AD −40 °C to +125 °C 74LVC04ADB −40 °C to +125 °C 74LVC04APW −40 °C to +125 °C 74LVC04ABQ Description SO14 plastic small outline package; 14 leads; body width 3.9 mm SSOP14 plastic shrink small outline package; 14 leads; ...

Page 2

... NXP Semiconductors 4. Functional diagram mna342 Fig 1. Logic symbol 5. Pinning information 5.1 Pinning GND 001aac915 Fig 4. Pin configuration SO14 and (T)SSOP14 74LVC04A Product data sheet mna343 Fig 2. IEC logic symbol (1) The die substrate is attached to this pad using Fig 5. All information provided in this document is subject to legal disclaimers. ...

Page 3

... NXP Semiconductors 5.2 Pin description Table 2. Pin description Symbol Pin GND Functional description [1] Table 3. Function table Input [ HIGH voltage level LOW voltage level 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...

Page 4

... NXP Semiconductors [2] The output voltage ratings may be exceeded if the output current ratings are observed. For SO14 packages: above 70 °C derate linearly with 8 mW/K. [3] For SSOP14 and TSSOP14 packages: above 60 °C derate linearly with 5.5 mW/K. For DHVQFN14 packages: above 60 °C derate linearly with 4.5 mW/K. ...

Page 5

... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions I supply current ΔI additional per input pin; CC supply current input 3 capacitance V = GND [1] All typical values are measured at V 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V) ...

Page 6

... NXP Semiconductors 11. Waveforms ≥ 0.5 × < 2 and V are typical output voltage levels that occur with the output load Fig 6. The input nA to output nY propagation delays Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance ...

Page 7

... NXP Semiconductors Table 8. Test data Supply voltage 1.2 V 2 3.6 V 74LVC04A Product data sheet Input ≤ 2 ≤ 2.5 ns 2.7 V ≤ 2.5 ns 2.7 V All information provided in this document is subject to legal disclaimers. Rev. 7 — 1 February 2011 74LVC04A Hex inverter Load 500 Ω ...

Page 8

... NXP Semiconductors 12. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

Page 9

... NXP Semiconductors SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT337-1 Fig 9. ...

Page 10

... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...

Page 11

... NXP Semiconductors DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...

Page 12

... Document ID Release date 74LVC04A v.7 20110201 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 7 74LVC04A v.6 20030904 74LVC04A v ...

Page 13

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 14

... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16. Contact information For more information, please visit: For sales office addresses, please send an email to: 74LVC04A Product data sheet 15 ...

Page 15

... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 Abbreviations ...

Related keywords