74LVT244ADB NXP Semiconductors, 74LVT244ADB Datasheet
74LVT244ADB
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74LVT244ADB Summary of contents
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... HBM JESD22-A114E exceeds 2000 JESD22-A115-A exceeds 200 V 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 74LVT244AD +85 C 74LVTH244AD 74LVT244ADB +85 C 74LVTH244ADB 74LVT244APW +85 C 74LVTH244APW 74LVT244ABQ +85 C 74LVTH244ABQ Description SO20 plastic small outline package; 20 leads; body width 7.5 mm SSOP20 plastic shrink small outline package ...
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... NXP Semiconductors 4. Functional diagram 1A0 2 1A1 4 1A2 6 1A3 8 1OE 1 2A0 11 2A1 13 2A2 15 2A3 17 2OE 19 Fig 1. Logic symbol 74LVT_LVTH244A_4 Product data sheet 74LVT244A; 74LVTH244A 1Y0 18 1Y1 16 1Y2 14 1Y3 12 2Y0 9 2Y1 7 2Y2 5 2Y3 3 mna825 Fig 2. Rev. 04 — 3 September 2008 3.3 V octal buffer/line driver; 3-state ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning 74LVT244A 74LVTH244A 1OE 1 1A0 2 3 2Y3 4 1A1 2Y2 5 1A2 6 7 2Y1 1A3 8 2Y0 9 10 GND Fig 3. Pin configuration for SO20 and (T)SSOP20 5.2 Pin description Table 2. Pin description Symbol Pin 1OE, 2OE 1, 19 1A0, 1A1, 1A2, 1A3 ...
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... NXP Semiconductors 6. Functional description 6.1 Function table [1] Table 3. Function table Control nOE HIGH voltage level LOW voltage level don’t care high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 5. Operating conditions Symbol Parameter I LOW-level output current OL T ambient temperature amb t/ V input transition rise and fall rate outputs enabled 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter [ +85 C amb ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter I OFF-state output current OZ I supply current CC I additional supply current CC C input capacitance I C output capacitance O [1] All typical values are amb [2] Unused pins GND. ...
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... NXP Semiconductors Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter t LOW to OFF-state PLZ propagation delay [1] All typical values are 3.3 V and T CC 11. Waveforms Measurement points are given in V and V are typical voltage output levels that occur with the output load. ...
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... NXP Semiconductors Test data is given in Table Definitions test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Test voltage for switching times. EXT Fig 7. Load circuitry for switching times Table 9. Test data Input 2.7 V ...
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... NXP Semiconductors 12. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 2.65 mm 0.25 0.1 2.25 0.012 0.096 0.1 inches 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT339-1 Fig 9. ...
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... NXP Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... Release date 74LVT_LVTH244A_4 20080903 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 3 “Ordering information” added. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Abbreviations ...